SolidRun Unveils It’s Groundbreaking Fusion of AMD Ryzen™ AI and Hailo AI Accelerators

In this article:

  1. Introduction
  2. The Innovative Bedrock R8000
  3. Key Features of Bedrock R8000
  4. Specifications
  5. Possible Applications
  6. Summary

Introduction

SolidRun has unveiled the Bedrock R8000 Series, pioneering industrial PC’s that leverage the cutting-edge AMD Ryzen™ Embedded 8000 series, ushering in a new era of AI capabilities with support for multiple Hailo-10™ and Hailo-8™ AI accelerators. This groundbreaking fusion of AMD Ryzen™ AI and Hailo AI accelerators delivers unparalleled Generative AI and AI Inferencing prowess, all within a compact and robust x86 edge device.

Equipped with a built-in Ryzen AI NPU boasting 16 TOPS, and scalable up to an impressive 39 TOPS for maximum performance, the versatile Bedrock R8000, supports two AI accelerators:

  • Hailo-8, delivering 26 TOPS and excelling in AI inferencing.
  • Hailo-10, optimised for Generative AI tasks, providing a robust 40 TOPS.

The Bedrock R8000 series is capable of accommodating up to three AI accelerators, resulting in a combined performance exceeding 100 TOPS.

The AMD Ryzen™ Embedded 8000 processor boasts an 8-core/16-thread Zen4 CPU clocked up to 5.1 GHz, accompanied by a Radeon 780M GPU featuring 6 WGPs/12 CUs, a 16 TOPS NPU, and fortified with AMD PRO technologies for heightened security, manageability, and reliability. Offering an extended lifespan of 10 years, the Ryzen Embedded 8000 ensures longevity and stability.

The Innovative Bedrock R8000

Enclosed within a sturdy, heavy-duty machined aluminum casing with an anodised finish, the Bedrock R8000 is available in three distinct variants. These include a 1.0-litre enclosure designed to dissipate up to 30W of heat through convection, a 1.6-litre version capable of managing 60W of heat, and a compact 0.6-litre “Tile” variant optimised for conduction cooling.

The innovative modular design of Bedrock R8000 unleashes a full spectrum of potent I/O capabilities, encompassing up to 96 GB DDR5-5600 ECC RAM, x20 PCIe Gen 4, four 4K displays, and dual USB4 40 Gbps interfaces.

Renowned for its remarkable passive cooling capabilities, the Bedrock R8000 operates flawlessly across the industrial temperature range from -40ºC to 85ºC, seamlessly integrating into the Bedrock family’s modular ecosystem.

The CPU seamlessly connects with the chassis through liquid metal TIM, minimising thermal resistance.  Heat management is further enhanced by stacked heatpipes, evenly dispersing heat 360º around the robust all-aluminum chassis. Optimal convective heat transfer is achieved through dual-layered chassis walls: aluminum air-ducts induce airflow via chimney effect, complemented by traditional cooling ribs.  This unmatched cooling efficiency with Bedrock, means it is capable of dissipating over three times the power compared to fanless computers of similar dimensions.

Introducing new modules alongside the Bedrock R8000, including the NIO R8000 4X25 featuring 4x 2.5 GbE ports and USB4, and the PM-1248, a cost-effective power module supporting 12V-48V DC input, SolidRun pioneers advancements in Edge AI hardware solutions.

Built on a foundation of reliability, Bedrock draws from decades of expertise in industrial computer and embedded systems development. Its DC power system, features a terminal block with screw locking, offering a versatile voltage range of 12V to 60V with dual-stage regulation for enhanced stability.

For added data integrity, Bedrock’s RAM supports Error-Correcting Code (ECC), while optional NVMe storage with Power-Loss-Protection (PLP) ensures data security in case of unexpected power loss.

To safeguard against system failures, Bedrock incorporates redundant SPI Flash to mitigate BIOS corruption risks, along with Watchdog Timer (WDT) and Trusted Platform Module (TPM) functionalities.

Designed for durability, Bedrock’s rugged enclosure boasts an all-aluminum construction, fanless operation, and ventless, dust-resistant IP40 rating.

Tailored to meet the diverse needs of the IoT landscape, the Bedrock R8000 series comprises of the following key components:

  • System on Module (SoM): Houses the CPU, DDR5 RAM memory, and NVMe slots, along with all native interfaces, connected via 380 pins of high-density connectors.
  • Networking and I/O Board (NIO): Equipped with NICs and various ports for seamless connectivity.
  • Storage and Extension Cards Board (SX): Offers slots for additional NVMe devices, WiFi, and 5G modems to expand functionality.
  • Power Module (PM): Features a DC to DC converter and DC input connector for efficient power management.

In certain integration scenarios, such as when additional devices need to be housed alongside the computer, custom enclosures are essential. The Bedrock introduces the innovative Deck concept (referred to as ‘deck-of-cards’) to address these specific needs.

The Deck securely holds together the SoM, NIO, SX, and PM components with fasteners, independently of the Bedrock enclosure. This modular approach facilitates versatile configurations tailored to individual requirements.

Featuring a copper heat-plate on the CPU, the Deck provides efficient first-stage cooling for various devices. With just three screws, the Deck can be effortlessly fastened to the custom chassis, ensuring thermal coupling to critical components like the CPU, RAM, NVMe, and FETs.

Moreover, the DC input connector, conveniently located on wires, offers flexibility for relocation within the chassis, further enhancing customisation possibilities.

This modular architecture empowers agile customisation of Bedrock to meet specific requirements.  SolidRun provides a range of NIO, SX, and PM boards that can be mixed and matched for off-the-shelf solutions. Additionally, they offer ODM services for developing custom boards upon request.

Bedrock’s enclosure is designed for easy customisation, allowing cost-effective modifications such as I/O adjustments, power input variations, and antenna openings, even for small volume orders.

The fanless and ventless industrial computer solution requires no regular upkeep. Designed for seamless operation in the field, Bedrock eliminates the need for frequent openings.

SIM card access is simplified with pin-hole trays located on the panel, ensuring easy installation and replacement. For added convenience, the remote power button connector is conveniently positioned on the top panel, offering effortless access.

With all brackets and mounting fixtures assembled from the outside, Bedrock streamlines installation processes. In the rare event that access is required, such as for storage device installation or RTC battery replacement, Bedrock can be easily opened with just a single screw.

In situations where convection cooling proves ineffective due to space constraints, conduction cooling emerges as the optimal solution. Compactness and thinness are also crucial factors when integrating an industrial computer into tight spaces.

The Bedrock Tile is specially crafted to meet these exact requirements. Unlike traditional ribbed chassis walls, Bedrock Tile features flat walls with blind threadings, facilitating seamless fastening to a cold plate. One standout feature of Bedrock Tile is its ability to maintain 360º internal heat distribution, enabling cooling from either side.

With a slim profile measuring just 29mm thick and a volume of only 0.6 liters, Bedrock Tile effortlessly integrates into confined spaces. Additionally, consolidating all connectors on one side streamlines the integration process even further.

Irad Stavi, IPC Product Line Manager at SolidRun, emphasises the pivotal role of Bedrock R8000 in catering to the evolving demands of Edge AI applications, offering unparalleled performance, scalability, and modularity. With a commitment to continuous innovation, SolidRun is poised to introduce groundbreaking features to the Bedrock ecosystem later this year.

Key Features of Bedrock R8000

  • Powered by AMD Ryzen™ Embedded 8845HS, AMD Ryzen™ 9 8945HS, and other APUs in the Ryzen 8000 “Hawk Point” family, with CPU power adjustable between 8W – 54W for tailored performance.
  • Supports up to 3 AI accelerators, accommodating both Generative-AI optimized Hailo-10™ and AI-Inferencing optimized Hailo-8™.
  • Modular RAM and storage configuration with support for 96 GB DDR5 ECC/non-ECC and enterprise-grade NVME storage devices.
  • Versatile I/O configurations, including up to 4 displays, multiple Ethernet ports, optional WiFi 6E + BT 5.3, USB4 type-C, and USB 3.2 ports, facilitating seamless integration.
  • Compatible with major PC operating systems, including Linux distributions, Windows Desktop, Server, and IoT.

Power, Mechanical, and Thermal Design:

  • Modular electronic design with SoM architecture, facilitated by optional Power Modules (PM) supporting various deployment scenarios.
  • Robust enclosure crafted from heavy-duty machined aluminum, available in different variants to accommodate varying power dissipation needs.
  • Fanless design capable of dissipating up to 60W, thanks to innovative cooling technologies such as liquid metal TIM, stacked heat pipes, and a dual-layer chimney effect heat exchanger.
  • Reliable operation in extreme temperatures ranging from -40ºC to 85ºC, ideal for challenging environments.

By integrating cutting-edge technologies and innovative design, the Bedrock R8000 redefines Edge AI hardware, offering unmatched performance, scalability, and reliability for diverse industrial applications.

Specifications

FEATURE
CPU Ryzen Embedded 8845HS | Ryzen 9 8945HS | Ryzen Embedded 8840U
GPU AMD Radeon™ 780M
NPU AMD Ryzen™ AI 16 TOPS
AI Acceleration 3x Hailo-8 26 TOPS | 2x Hailo-10 40 TOPS
RAM 128 bit DDR5 5600 up to 96 GB ECC / non-ECC (2x SODIMM)
Display 4 display outputs HDMI 2.1 | DisplayPort 2.1
Storage 3x NVMe PCIe Gen4 x 4
LAN 4x 2.5 GbE (Intel I226)
WLAN WiFi 6E + BT 5.3 (Intel AX210)
Modem 4G / 5G (Quectel)
USB 1x USB 4.0 40 Gb/s, 1x USB 3.2 gen 2 10 Gb/s, 3x USB 3.2 gen 2 5 Gb/s
Console Serial over USB
BIOS AMI Aptio V
Operating systems Windows 10/11/IoT, Linux
Power 12V-60V DC
Temperature range -40ºC to 85ºC
Enclosure All aluminum enclosure, fanless cooling
Dimensions 30W model: 45 mm (W) x 160 mm (H) x 130 mm (D) – 0.9 liter
60W model: 73 mm (W) x 160 mm (H) x 130 mm (D) – 1.5 liter
Tile model: 29 mm (W) x 160 mm (H) x 130 mm (D) – 0.6 liter”
Mounting DIN-rail, wall, VESA, table top

Possible Applications

The Bedrock R8000, equipped with advanced AMD Ryzen™ Embedded 8000 series processors and Hailo AI accelerators, opens up a plethora of applications across various industries. Here are some potential applications:

  1. Smart Manufacturing: In smart factories, the Bedrock R8000 can enable real-time monitoring and analysis of production processes, predictive maintenance of machinery, and quality control through AI-powered visual inspection systems.
  2. Autonomous Vehicles: Utilising the high-performance AI capabilities of the Bedrock R8000, autonomous vehicles can process sensor data for navigation, object detection, and decision-making, enhancing safety and efficiency on the road.
  3. Smart Cities: Deployed in urban infrastructure, the Bedrock R8000 can support intelligent traffic management systems, optimise energy usage in buildings, and enable smart grid solutions for efficient power distribution.
  4. Healthcare: In healthcare facilities, the R8000 can power AI-driven diagnostic tools, analyise medical images and patient data for early disease detection, and assist in personalised treatment plans based on patient-specific data.
  5. Retail: Retailers can leverage the Bedrock R8000 for customer behavior analysis, inventory management, and personalised marketing strategies through AI-driven insights and recommendation systems.
  6. Security and Surveillance: The R8000 can enhance security systems by enabling real-time video analytics for threat detection, facial recognition, and monitoring of critical infrastructure.
  7. Agriculture: In precision agriculture, the Bedrock R8000 can process data from drones, sensors, and satellite imagery to optimise crop management practices, improve yields, and reduce resource consumption.
  8. Telecommunications: Telecom operators can utilise the R8000 for network optimization, predictive maintenance of infrastructure, and intelligent traffic routing to improve service quality and reliability.
  9. Energy: In the energy sector, the Bedrock R8000 can support smart grid management, renewable energy integration, and predictive maintenance of power generation assets for enhanced efficiency and reliability.
  10. Logistics and Supply Chain: The R8000 can optimise logistics operations through AI-powered route planning, demand forecasting, and inventory optimisation, reducing costs and improving delivery efficiency.

Overall, the Bedrock R8000’s robust performance, scalability, and reliability make it suitable for a wide range of applications, driving innovation and efficiency across industries.

Summary

In summary, the Bedrock R8000, powered by advanced AMD Ryzen™ Embedded 8000 processors and Hailo AI accelerators, is a versatile industrial PC with extensive applications across various industries. Its high-performance AI capabilities enable real-time processing and analysis of data, driving innovation and efficiency in diverse fields. From smart manufacturing and autonomous vehicles to healthcare, retail, security, agriculture, telecommunications, energy, logistics, and more, the Bedrock R8000 empowers organisations with intelligent solutions for enhanced productivity, safety, and sustainability. With its robust design, scalability, and reliability, the Bedrock R8000 serves as a cornerstone for transformative technologies in the modern world.

Here to Help

Tell Us About Your Project

We're embedded computer engineers, if you have a project and need advice we can help.