FAQ

MXM stands for Mobile PCI Express Module. It is a standardised form factor for graphics processing units (GPUs) used in laptops and other mobile computing devices.

USB stands for Universal Serial Bus. It is an industry-standard interface that enables communication and data transfer between electronic devices and computers.

A GbE controller, short for Gigabit Ethernet controller, is a hardware component designed to facilitate high-speed data transmission over Gigabit Ethernet networks.

TDP (Thermal Design Power) represents the maximum amount of heat that a component, such as a CPU or GPU, is expected to dissipate under normal operating conditions.

Neural Compute Engines (NCEs) are specialised hardware components or processing units designed to accelerate neural network computations, particularly for artificial intelligence (AI) and machine learning (ML) tasks.

Low Power Islands are specific regions within integrated circuits (ICs), like System on a Chip (SoC), designed to operate at lower power consumption levels compared to the rest of the circuitry.

A System on a Chip (SoC) is a highly integrated semiconductor device that incorporates multiple electronic components of a computer or electronic system onto a single chip.

IPC stands for instructions per cycle/clock. This tells you how many things a CPU can do in one cycle.

3D chip stacking, also known as 3D packaging or 3D integration, is a technology used in semiconductor manufacturing where multiple semiconductor dies (chips) are vertically stacked on top of each other to form a single integrated circuit (IC) package.

Industrial automation involves the application of various technologies to automate tasks traditionally performed by humans. It aims to boost productivity, reduce errors, and optimise resource utilisation across different stages of manufacturing, from raw material handling to assembly and quality control.