DFI COM331-B with COM Express R2.0, Pin-out Type 6 and microATX form factor
DFI COM331-B with COM Express R2.0, Pin-out Type 6 and microATX form factor
COM331-B
- COM Express® R2.0, Pin-out Type 6
- Supports Compact/Basic modules
- Multiple displays: 1 x LVDS, 1 x VGA, 2 x DP
- Rich I/O: 1 x GbE, 4 x USB 3.0, 4 x USB 2.0, 4 x COM
- microATX form factor

Details
The DFI COM331-B is a Carrier Board COM Express R2.0, Pin-out Type 6 which Supports Compact/Basic modules. The DFI COM331-B has Multiple displays: 1 x LVDS, 1 x VGA, 2 x DP with Rich I/O: 1 x GbE, 4 x USB 3.0, 4 x USB 2.0, 4 x COM alongside microATX form factor.
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Specification
Graphics
Display
1 x VGA1 x LVDS3 x DP
Expansion
Interface
1 x PCIe x16 (Gen 3)1 x PCIe x4 (Gen 2)2 PCIe x 11 x Full-size Mini PCIe
Audio
Audio Codec
Realtek ALC886
Rear I/O
Ethernet
1 x GbE (RJ-45)
Serial
1 x RS232 serial ports1 x RS232 Serial Interface Connector2 x Serial Interface Connector (TX/RX)
USB
4 x USB 3.04 x USB 2.0
Display
1 x VGA2 x DP
Audio
1 x Line-in1 x Line-out1 x Mic-in
Internal I/O
Serial
1 x RS232 Serial Interface Connector2 x Serial Interface Connector (TX/RX)
Display
1 x VGA (2.54mm)1 x LVDS LCD Panel Connector1 x DP
Audio
1 x Audio (Line-out/Mic-in)1 x S/PDIF
SATA
2 x SATA 3.0 (up to 6Gb/s)2 x SATA 2.0 (up to 3Gb/s)
DIO
1 x 8-bit DIO1 x SDIO slot
LPC
1 x LPC
SMBus
1 x SMBus
I2C
1 x I2C
Power
Type
12V, 5VSB, VCC_RTC (ATX mode) 12V, VCC_RTC (AT mode)
Connector
4-pin ATX 12V power 24-pin ATX power
Environment
Temperature
Operating: 0 to 60°CStorage: -20 to 85°C
Humidity
Operating: 5 to 90% RHStorage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
microATX Form Factor 244mm (9.6″) x 244mm (9.6″)
Compliance
PICMG COM Express® R2.0, Type 6 Basic, Compact Modules
Packing List
Packing List
1 COM331-B board2 Serial ATA data cables1 COM port cable (with bracket)1 QR (Quick Reference)1 DVD
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