Bedrock R7000 Edge AI 30W

SolidRun Bedrock R7000 Edge AI 30W Model 3 x Halo-8 AI Accelerators AMD Ryzen™ 780M GPU Embedded AMD Ryzen™ 7 7840HS / 7840U

Bedrock R7000 Edge AI 30W

  • 1st industrial PC with AMD Ryzen and 3 Hailo-8 AI accelerators
  • Remarkable AI inferencing performance of 78 TOPS
  • State of the art thermal design for operation in -40ºC to 85ºC
  • Easy-to-integrate compact design with DIN-Rail mounting, 12V-60V DC input

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Details

Highly Efficient Scalable Performance

SolidRun Bedrock R7000 Edge AI is powered by AMD RyzenTM 7 7840HS / 7840U processor coupled with up to 3 Hailo-8TM AI accelerators, each with 26 Tera Operations per Second (TOPS). The 5.1 GHz 8 Core Zen 4 CPU and integrated AMD RadeonTM 780M GPU are powerful enough for real-time acquisition of dozens of hi-res video streams and AI inferencing using multiple Hailo-8TM accelerators, each at 100% utilization for AI performance of 78 TOPs – three times the performance of other ruggedized edge AI PCs.

Packed Solid With Features

Edge AI computer has tasks beyond inferencing. Bedrock R7000 Edge AI stand out in compute and graphics performance, as well as in I/O, storage and networking capabilities. 4 display outputs HDMI 2.1 / DP 2.1 each 8K capable or 4x4K are driven by the powerful Radeon 780M GPU. 64 GB DDR5 with ECC, NVME Gen4 2280, 2x 2.5 GbE ports, 5G modem with dual SIM and 4 USB ports. All these features are tightly packed in a fanless enclosure of under 1 liter.

Note: WiFi 6E and up to 2x extra NVME devices can be installed if less than 3 AI accelerators are used.

Remarkable Fanless Cooling

Hot chips require innovative cooling. Bedrock was designed from the ground up for effective fanless cooling. The CPU is thermally coupled to the chassis using liquid metal TIM to reduce thermal resistance. Stacked heatpipes distribute the heat evenly 360º around the all-aluminum chassis. To optimize convective heat transfer, each chassis wall has two heat exchange layers – aluminum air-ducts that stimulate airflow by chimney effect, and another layer of conventional cooling ribs. As a result, Bedrock can dissipate over 3 times the power of fanless computers of similar size.

Full Control of CPU Power

With Bedrock R7000 you don’t have to guess how much power the system draws. Instead you can precisely set CPU power limit across an exceptionally broad power range of 8W to 54W. This is particularly useful in scenarios where limited power has to be shared between the IPC and additional devices, and when integration constraints prevent ideal heat dissipation.

Rock Solid Reliability

Bedrock is designed with reliability in mind based on decades of experience in development of IPCs and embedded systems. DC power is through a terminal block with screw locking and has a wide voltage range of 12V – 60V with two stages of regulation. RAM supports ECC. NVMe with power-loss-protection (PLP) can be ordered. Bedrock has redundant SPI Flash to prevent bricking by BIOS corruption as well as WDT and TPM. The enclosure is extremely ruggedised – all-aluminium, fanless and ventless dust-resistant IP40.
Innovative Modular Design
Bedrock is designed to address the diversity of requirements in the IoT space. This is achieved by partitioning the hardware into the following boards:
  • SoM with the CPU, DDR5 and NVMe slots and all native interfaces on 380 pins of high density connectors.
  • Networking and I/O board (NIO) with NICs and ports.
  • Storage and Extension Cards board (SX) with slots for WiFi, 5G modem and extra NVMe devices.
  • Power Module (PM) with DC to DC converter and DC input connector.
This modular design enables agile customization of Bedrock for addressing specific requirements. SolidRun is developing multiple NIO, SX and PM boards that can be mixed and matched as an off-the-shelf solution and also offers development of custom boards as an ODM service. Customers and 3rd parties that are interested in developing custom NIO, SX or PM boards are welcome to contact SolidRun for support.Bedrock enclosure is designed with customization in mind. Modification of I/O, power input, antenna openings etc. can be performed cost effectively even in small volume.
Painless Integration
The compact footprint of Bedrock, robust structure, effective fanless cooling and DC input tolerance simplify Bedrock integration. All Bedrock I/O is brought to the front panel, with DC input and antennas in the top panel. The bottom and rear panel are both reserved for mounting, allowing full usability while Bedrock is mounted to a wall or to a desk. SolidRun offers multiple types of mounting brackets, including lever-based DIN-Rail bracket with locking, wall mount, small stand and ruggedised stand.

Field Usability

As a fanless, ventless IPC Bedrock requires no maintenance. Bedrock is designed to avoid the need to open it in the field. SIM cards are accessible from the panel using pin-hole trays. Remote power button connector is conveniently located on the top panel. All brackets and mounting fixtures are assembled from the outside. Should the need arise to open Bedrock (e.g. to install a storage device or replace the RTC battery) Bedrock opens by unscrewing a single screw.

The 0.6 Litre Bedrock Tile

When integrating an IPC in tight space convection cooling becomes ineffective and is better replaced with conduction cooling. It is also desirable to make the IPC as compact and thin as possible. Bedrock Tile is designed for these use cases. The ribbed chassis walls are replaced with flat walls with blind threadings for fastening Bedrock Tile to a cold plate. A key feature of Bedrock Tile is that it preserves the 360º internal heat distribution so it can be cooled from either side. With thickness of just 29mm and volume of 0.6 liter, Bedrock Tile is easy to integrate in tight spaces. Having all connectors on one side further simplifies the integration.

Advanced Integration Using Deck

Some integration scenarios call for custom enclosures (e.g. when additional devices must be installed with the computer in the same housing). To support these use cases Bedrock introduces the Deck concept (deck-of-cards). The SoM, NIO, SX and PM are rigidly held together with fasteners independently of the Bedrock enclosure. The Deck provides first stage cooling for most devices, in particular it includes a copper heat-plate on the CPU. The Deck is fastened to the custom chassis with only 3 screws. Fastening provides thermal coupling to the CPU, RAM, NVMe and FETs. The DC input connector is on wires and can be relocated in the chassis.

Designing with Bedrock SoM

Bedrock SoM makes a convenient and flexible building block for board designers. For many developers, using Bedrock R7000 SoM would be the best way to develop a custom appliance based on the popular AMD RyzenTM 7040 series. Bedrock SoM makes an attractive platform for that purpose for several reasons. The SoM is far more self-contained than traditional SoMs. It has not only the essential CPU and RAM, but also NVMe, direct DC input with 12V – 19V tolerance and RTC battery. The SoM is provided in a ruggedized metal skirt that protects the SoM, provides mounting fixture for extension cards and serves as a heat-spreader for secondary heat sources. Copper heat-plate is pre-assembled on the CPU.
 

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Specification

FEATURE SPECIFICATION NOTES
CPU AMD RyzenTM 7040 Series 8C/16T Zen4 4nm Up to 5.1 GHz Up to 54W
GPU AMD RadeonTM 780M Up to 12 CU @ 2700 MHz
RAM Dual channel DDR5 up to 64 GB ECC / non-ECC 2x SODIMM (2×32 bit each) RAM is conduction cooled
Display 1x HDMI 2.1 1x Display Port 2.1 2x mini-DisplayPort 2.1 Max resolution / refresh rate: 7680×4320 @ 60Hz 3840×2160 @ 240Hz
Storage Up to 3x NVMe PCIe Gen4 x 4 M.2 key-M 2280 Optional power-loss-protection NVMe is conduction cooled Each 2nd/3rd NVMe precludes one Hailo-8 key-M
AI Acceleration Up to 3x Hailo-8 M.2 AI Acceleration Module 2x M.2 key-M 2242 (each precludes an NVME) 1x M.2 key-E 2230 (precludes WiFi) Conduction cooled
LAN 2x 2.5 GbE (Intel I226) 2x RJ45
WLAN WiFi 6E (Intel AX210) BT 5.3 2x RP-SMA antennas Optional and upgradable (M.2 key-E 2230) WiFi precludes use of Hailo-8 key-E
Modem 4G / 5G (Quectel) 2x SMA antennasOptional and upgradable (M.2 key-B 3042 / 3052)
USB 1x USB 3.2 gen 2 10 Gb/s 3x USB 3.2 gen 2 5 Gb/s Connectors: 4x USB type-A
Console Serial over USB mini-USB connector
BIOS AMI Aptio V Dual SPI FLASH for redundancy Console redirection
Operating systems Windows 10/11/IoT, Linux Other x86 operating systems supported
Power DC 12V-60V Phoenix terminal Other DC connectors available
Temperature range Up to -40ºC to 85ºC Also available in commercial temperature range
Dimensions 30W model: 45 mm (W) x 160 mm (H) x 130 mm (D) – 0.9 liter 60W model: 73 mm (W) x 160 mm (H) x 130 mm (D) – 1.5 liter Tile model: 29 mm (W) x 160 mm (H) x 130 mm (D) – 0.6 liter
Mounting DIN-rail, wall, table top

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