DFI SH960-HM170 Basic Type 6 with 6th Gen Intel Core Processor, Intel HM170

DFI Official Distributor

Model No:

SH960-HM170

Highlights:

6th Gen Intel® Core™, Intel® HM170 Chipset
Rich I/O: 1 Intel GbE, 4 x USB 3.0, 8 x USB 2.0
Multiple expansion: 1 PCIe x16, 8 PCIe x1
Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
Dual channel DDR4 2133MHz SODIMM up to 32GB
15-Year CPU Life Cycle Support Until Q4' 29 (Based on Intel IOTG Roadmap)

Downloads:

DFI SH960-HM170 Datasheet

Overview

The DFI has Introduced the SH960-HM170 COM Express Type 6 module powered by the 6th Generation Intel® Core™ processor family (codename Skylake). The Mobile-based module features enhanced graphics performance and high computing while ULT-based module features low power and fanless design making them well suited for industrial application in gaming, medical, digital signage, and factory automation. With more and more requirements in the gaming market, gaming machine manufacturers continue to search for the right solution to obtain rich immersive graphics and performance that end users come to expect today. Aimed at the application, DFI developed COM Express Basic based on mobile platform featuring super-fast 2133 DDR4 memory up to 32 GB for faster data transfer and 3 independent displays with high resolution (HDMI/DP++/eDP supports up to 4K x 2K) for greater gaming experience.

Main Features

System

Processor

6th Generation Intel® Core™ Processors, BGA 1440
Intel® Core™ i7-6820EQ Processor, Quad Core, 8M Cache, 2.8GHz (3.5GHz), 45W
Intel® Core™ i7-6822EQ Processor, Quad Core, 8M Cache, 2.0GHz (2.8GHz), 25W
Intel® Core™ i5-6440EQ Processor, Quad Core, 6M Cache, 2.7GHz (3.4GHz), 45W
Intel® Core™ i5-6442EQ Processor, Quad Core, 6M Cache, 1.9GHz (2.7GHz), 25W
Intel® Core™ i3-6100E Processor, Dual Core, 3M Cache, 2.7GHz, 35W
Intel® Core™ i3-6102E Processor, Dual Core, 3M Cache, 1.9GHz, 25W
Intel® Celeron® Processor G3900E, Dual Core, 2M Cache, 2.4GHz, 35W
Intel® Celeron® Processor G3902E, Dual Core, 2M Cache, 1.6GHz, 25W

Chipset

Intel® HM170 Chipset

Memory

Two 260-pin SODIMM up to 32GB Dual Channel DDR4 2133MHz

BIOS

Insyde SPI 128Mbit

Graphics

Controller

Intel® HD Graphics GT Series

Feature

OpenGL up to 4.4, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9

Display

1 x VGA/DDI (DDI available upon request)
1 x LVDS/eDP (eDP available upon request)
2 x DDI (HDMI/DVI/DP++)
VGA: resolution up to 1920x1200 @ 60Hz
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz
HDMI: resolution up to 4096x2160 @ 24Hz or 2560x1600 @ 60Hz
DVI: resolution up to 1920x1200 @ 60Hz
DP++/eDP: resolution up to 4096x2304 @ 60Hz

Triple Displays

VGA + LVDS + DDI or VGA + DDI1 + DDI2
eDP + 2 DDI (available upon request)

Expansion

Interface

1 x PCIe x16 or 2 x PCIe x8 (Gen 3)
8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 (Gen 3)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)

Audio

Interface

HD Audio

Ethernet

Controller

1 x Intel® I219LM with iAMT11.0 PCIe (10/100/1000Mbps)

I/O

USB

4 x USB 3.0
8 x USB 2.0

SATA

4 x SATA 3.0 (up to 6Gb/s) RAID 0/1/5/10

DIO

1 x 8-bit DIO

Watchdog Timer

Output & Interval

System Reset, Programmable via Software from 1 to 255 Seconds

Security

TPM

Available Upon Request

Power

Type

12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)

Consumption

TBD

OS Support

Windows 7 (/WES7) 32/64-bit
Windows 8.1 (64-bit)
Windows 10 IoT Enterprise 64-bit
Debian 8 (with VESA graphic driver)
CentOS 7 (with VESA graphic driver)
Linux

Environment

Temperature

Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C

Humidity

Operating: 5 to 90% RH
Storage: 5 to 90% RH

MTBF

663,394hrs @ 25°C; 334,612 hrs @ 45°C; 193,307 hrs @ 60°C excluding accessories
Calculation Model: Telcordia Issue 2, Method Case 3
Environment: GB, GC – Ground Benign, Controlled

Mechanism

Dimensions

COM Express® Basic 95mm (3.74") x 125mm (4.9")

Compliance

PICMG COM Express® R2.1, Type 6

Standards and Certifications

Certifications

CE, FCC

Packing List

1 SH960-HM170 board
1 Cooler (Height: 36.58mm): A71-111026-000G

Ordering Info

SH960-HM170TS-6100E770-SH9604-800G