Nexcom aROK 8110 8/9th Gen Intel Core/Xeon & AI Powered Advanced NVIDIA Solution

Nexcom Official Distributor
Nexcom Official Distributor
Model No:
aROK 8110
Highlights:
  • Rolling stock AI recognition and machine vision applications
  • Up to 8-core Intel 8th/9th Gen Core/Xeon CPU processing power
  • 4 x PCIe 3.0 slots for discrete graphics/inference/frame grabber cards
  • Ultra-fast NVMe M.2/U.2 media for high-speed multi-cameras image capture
  • RAID 0/1/5/10 configurable for data secure and integrity
  • 24/36 VDC input with ignition management
  • Special fixture design avoids vibration issues with GPU and PCIe cards
  • Functionality of WWAN/5G NR, WLAN and GNSS with up to 4 SIM slots
  • Compliant with EN 50155 OT4 and MIL-STD-810G for anti-vibration/shock w/ graphics card and PCIe card installed
  • Smart fan design with temperature-based RPMs
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Overview

AI has become an essential component of automated vehicle technology. With built-in high-performance Intel Coffee-Lake S/Refresh, or Xeon processing power and the powerful NVIDIA GeForce RTX 2080 Ti graphics engine with 4,352 CUDA cores, aROK 8110 can satisfy a wide variety of applications for the rolling stock applications, such as track obstacle inspection, traffic light, traffic sign recognition, pantograph inspection and highly-demanding on graphic performance. Extreme speed of data-storage has become more and more important as a rapid growth of high-speed multi-cameras with a high frame rates has taken place. For that, aROK 8110 is designed with up to 3 USB 3.1 and up to 12 GbE w/ PoE GigE M12 X-coded ports for high-end industrial cameras access to achieve a wire-speed performance. Also, the latest ultra-fast U.2/M.2 NVMe media and up to four 2.5” high-density SSD/HDD are carried out for customers to meet the requests of huge data streaming, secure and the integrity for multi-cameras installed. aROK 8110 also provides an excellent expanding capability for users to install up to four add-on PCIe cards like the frame grabber in GigE Vision interface, or a discrete graphics engine to enhance the graphics power. To position where you are and to keep connection with the remote central management while the system is on edge computing, aROK 8110 is the best choice for you to provide a telematics functionality, like up to two LTE/WLAN modems, GNSS w/ DR function and eMTC collaborated with other communication ports, RS232/422/485 and CAN 2.0B module, etc. aROK 8110 is a more elastic design for users to choose which CPU they want to operate. Also, it can support up to station-grade Xeon w/ up to 80W TDP to work with the most 250W RTX 2080 Ti discrete graphics card.

Main Features
CPU Intel Coffee-Lake S/Refresh Core/Xeon i7/i5/i3/Pentium/Celeron processor (LGA1151)
PCH Intel chipset C246
Memory Two 260-pin DDR4 SO-DMIM socketsUp to 32GB+32GB in size, 2400/2666 MHz
Storage 4 x 2.5” SATA 3.0 SSD/HDD (15mm height), or 3 x 2.5” SATA 3.0 SSD/HDD + 2 x M.2 2242/2260/2280 Key M NVMe SSD (PCIe 3.0 x2), or 3 x 2.5” SATA 3.0 SSD/HDD + 1 x U.2 NVMe SSD (PCIe 3.0 x2/SATA 3.0)1 x CFast (externally accessible)
Expansion 1 x Full size mPCIe socket (USB 2.0, PCIe 3.0)1 x Full size mPCIe socket (USB 2.0) for LTE module, BOM optional M.2 3042 Key B socket (USB 2.0) for LTE module with 1 x external, 1 x internal SIM1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen2) for LTE/5G NR module with 1 x external, 1 x internal SIM1 x PCIe 3.0 x16 slot for discrete graphics card, up to 321mm in length3 x PCIe 3.0 x4 slot, up to 240mm in length
GigE/Frame Grabber (optional) 4 Port independent GbE w/ 802.3af/at, max. 60W, M12 X-coded
Discrete Graphics Card (optional) Up to NVIDIA RTX 3090, 450W or more advanced in the future
GPS and Sensor 1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/BeidouOptional modules with dead reckoning availableBuilt-in G-sensor
LAN 2-Port independent GbE LAN, M12 X-coded9K byte jumbo framePTP (IEEE 1588) supportController: Intel® i210-T1, PHY: Intel® I219LMvPro (iAMT) & WOL support
Security TPM 2.0: Infineon SLB9660TT1.2-FW4.40 (BOM optional)
I/O Ports, Front-Plate Waterproof DC input connector with ignition for 24/36 VDC-INPower buttonReset button6 x LED indicators for power/IGN/WLAN/WWAN/LAN status4 x LED indicators for storage/fan control5 x LED indicators for user to program1 x USB 3.1 Gen2 + 1 x USB 2.0, type A1 x DB15 (CAN/DIO, 4 x DI/4 x DO + 1 x CAN 2.0B)1 x DB15 (EXT.), reserved for expansion (or DB9 for DR signal)7 x SMA antenna holes2 x DB9 (COM3/COM4) for RS232/RS422/RS485 selectable (isolation)
I/O Ports, Rear-Plate 2 x USB 3.1 Gen2, type A1 x M12 A-coded connector for 2 x USB 2.02 x GbE (M12 X-coded)1 x VGA + 1 x HDMI2 x DB9 (COM1/COM2) for RS232/RS422/RS485 selectable (isolation)2 x SIM slots1 x SMA antenna hole for GNSS6 x SMA antenna holes1 x PCIe x16 lane slot3 x PCIe x4 lane slots1 x DB9 (AUDIO, female) for 1 x Mic-in (stereo), 2 x Line-out (stereo)
Display 1 x VGA port, up to 1920 x 1200@60Hz1 x HDMI v1.4, up to 4096 x 2160@30Hz
DI/DO (isolation) 4-Bit input
 - Source: 9~48V-IN (12V@1.1mA/24V@2.2mA)
 - External: 0~33VDC pull-high, high-level, 3.3 - 33 VDC; low-level, 0-2 VDC4-Bit output
 - Source: 9~48V-IN (nominal 35mA@24V)
 - External: 5~27VDC pull-high, sink current w/ 220mA for each bit, 500mA max (@25C)Source or external can be selected by software (default: source type)
Fan 1 x CPU fan1 x System fan
CAN 2.0B (isolation) CAN 2.0B (isolation)Controller: SJA1000Bit rate up to 1Mbit/sSocket CAN supported11-bit & 29-bit identifiers, ISO 11898-1, ISO 11898-2ESD: ± 8KV/15KV (contact/air)2.5KV isolated
Power Management 24/36 VDC-INCranking voltage: 6V~9V (< 30 seconds)Reverse protection, OCP & UVPIgnition on/off control/programmable on/off delay timer
Operating System Windows 10/Linux
Dimensions 215 x 205 x 385 (W x D x H) (mm)
Weight 10.5 kg
Environment Operating temperatures
 - EN 50155, class OT4 -40~70°C, 85°C for 10 minutes (w/ 35W TDP CPU, industrial SSD) with air flowStorage temperatures: -40°C~85°CRelative humidity: 10%~95% (non-condensing)Vibration (random)
 - IEC 60068-2-64 1.0g@5~500Hz (in operating, HDD), 1.6g for HDD w/ damping brackets
 - IEC 60068-2-64 2.0g@5~500Hz (in operating, SSD + graphics card)Vibration (SSD + graphics card)
 - Operating: MIL-STD-810G, 514.6C, category 4
 - Storage: MIL-STD-810G, 514.6, category 24, minimum integrity testShock (SSD + graphics card)
 - Operating: MIL-STD-810G, Method 516.6, procedure I, functional shock=40g
 - Non-operating: MIL-STD-810G, Method 516.6, procedure V, crash hazard shock test=75g
Certifications CEFCC Class AEN 50155: 2017
 - Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
 - Interruptions of voltage supply class S1
 - Supply change over class C1, C2
 - EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
 - Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
 - Shock and vibration IEC 61373 Class B
 - Protective coating class PC1 (PC2, by request)EN 45545-2: 2013+A1:2015
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