DFI has launched two new COM Express Basic form factor modules - CR901-B Type 6 and CR900-B Type 2, offering the 3rd generation Intel® Core™ processors. The supported processors are built on Intel's 22-nanometer process technology and boast a 15% greater CPU performance over the previous generation processors. The boards support the quad-core Intel® Core™ i7-3610QE and the dual-core Intel® Core™ i5-3610ME processors. These processors offer higher performance at lower power consumption than the 2nd generation Intel® Core™ processors which are also supported on these module boards.
The low power module boards take full advantage of the mobile Intel® QM77 Express chipset which is packed with high performance I/O capabilities to provide increased mobile computing and graphics performance.
The Intel® HD Graphics 4000 engine integrated into the processors delivers up to 50% 3D graphics performance improvement and up to 1.8x HD to HD transcode performance increase. Targeted at multimedia and medical applications, CR901-B brings enhanced graphics performance by supporting 3 independent displays in any combination of VGA, LVDS and DDI (HDMI, DVI, DisplayPort, and SDVO) allowing you to choose the best combination to suit various applications requirements. CR900-B on the other hand supports VGA and LVDS interfaces for dual independent display with resolution up to 1920x1200 @ 60Hz.
The module boards support the same high performance I/O expansion except for CR901-B which supports the new USB 3.0 that is capable of processing more data load.
The mobile embedded module boards are ideal for applications requiring a stable revision-controlled platform, such as gaming, medical equipment, and KIOSK embedded applications.
- 3rd/2nd Gen Intel® Core™, Intel® QM77 Chipset
- Rich I/O: 1 Intel GbE, 4 x USB 3.0, 8 x USB 2.0
- Multiple expansion: 1 PCIe x16, 4 x SATA, 1 x LPC, 1 x I2C, 1 x SMBus
- 1 x VGA, 1 x LVDS, 3 x DDI (HDMI/DVI/DP/SDVO)
- Dual channel DDR3L 1600MHz SODIMM up to 16GB
- 7-Year CPU Life Cycle Support Until Q3' 18 (Based on Intel IOTG Roadmap)