DFI CR901-B Basic Type 2 supports 3rd/2nd Gen Intel Core with Intel QM77 Chipset

DFI Official Distributor
DFI Official Distributor
Model No:
CR901-B
Highlights:
  • 3rd/2nd Gen Intel® Core™, Intel® QM77 Chipset
  • Rich I/O: 1 Intel GbE, 4 x USB 3.0, 8 x USB 2.0
  • Multiple expansion: 1 PCIe x16, 4 x SATA, 1 x LPC, 1 x I2C, 1 x SMBus
  • 1 x VGA, 1 x LVDS, 3 x DDI (HDMI/DVI/DP/SDVO)
  • Dual channel DDR3L 1600MHz SODIMM up to 16GB
  • 7-Year CPU Life Cycle Support Until Q3' 18 (Based on Intel IOTG Roadmap)
QTY:
Overview

DFI has launched two new COM Express Basic form factor modules - CR901-B Type 6 and CR900-B Type 2, offering the 3rd generation Intel® Core™ processors. The supported processors are built on Intel's 22-nanometer process technology and boast a 15% greater CPU performance over the previous generation processors. The boards support the quad-core Intel® Core™ i7-3610QE and the dual-core Intel® Core™ i5-3610ME processors. These processors offer higher performance at lower power consumption than the 2nd generation Intel® Core™ processors which are also supported on these module boards.

The low power module boards take full advantage of the mobile Intel® QM77 Express chipset which is packed with high performance I/O capabilities to provide increased mobile computing and graphics performance.

The Intel® HD Graphics 4000 engine integrated into the processors delivers up to 50% 3D graphics performance improvement and up to 1.8x HD to HD transcode performance increase. Targeted at multimedia and medical applications, CR901-B brings enhanced graphics performance by supporting 3 independent displays in any combination of VGA, LVDS and DDI (HDMI, DVI, DisplayPort, and SDVO) allowing you to choose the best combination to suit various applications requirements. CR900-B on the other hand supports VGA and LVDS interfaces for dual independent display with resolution up to 1920x1200 @ 60Hz.

The module boards support the same high performance I/O expansion except for CR901-B which supports the new USB 3.0 that is capable of processing more data load.

The mobile embedded module boards are ideal for applications requiring a stable revision-controlled platform, such as gaming, medical equipment, and KIOSK embedded applications.

Main Features
System
 
Processor
Socket G2 988B for:
- 3rd generation Intel® Core™ processors (22nm process technology)
Intel® Core™ i5-3610ME, 3M Cache, 2.7GHz (3.3GHz), 35W
Intel® Celeron™ 1020E, 2M Cache, 2.20 GHz, 35W
- 2nd generation Intel® Core™ processors (32nm process technology)
Intel® Celeron™ B810E, 2M Cache, 1.6GHz, 35W
Intel® Celeron™ 847E, 2M Cache, 1.1GHz, 17W
Intel® Celeron™ 827E, 1.5M Cache, 1.4GHz, 17W
Chipset
Intel® QM77 Chipset
Memory
Two 204-pin SODIMM up to 16GB
Dual Channel DDR3L 1600MHz
BIOS
64Mbit SPI
 
Graphics
 
Controller
Intel® HD Graphics 4000 (3rd generation processors)
Intel® HD Graphics 3000 (2nd generation processors)
Intel® HD Graphics (Intel® Celeron™ processors)
Feature
DirectX Video Acceleration (DXVA) for accelerating video processing
- Full AVC/VC1/MPEG2 HW Decode
Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)
Display
1 x VGA
1 x LVDS
1 x DDI (HDMI/DVI/DP/SDVO)
VGA: resolution up to 2048x1536 @ 75Hz
LVDS: dual channel 36/48-bit, resolution up to 1920x1200 @ 60Hz
HDMI/DVI/DP: resolution up to 1920x1200 @ 60Hz
 
Expansion
 
Interface
1 PCIe x16
1 PCIe x4 and 3 PCIe x1 or 7 PCIe x1
1 x LPC
1 x I2C
1 x SMBus
2 x Serial (TX/RX)
 
Audio
 
Interface
HD Audio
 
Ethernet
 
Controller
1 x Intel® 82579LM (10/100/1000Mbps)
 
I/O
 
USB
4 x USB3.0
8 x USB2.0
SATA
2 x SATA 3.0 (up to 6Gb/s) RAID 0/1/5/10
2 x SATA 2.0 (up to 3Gb/s)
SSD
1 x 4GB/8GB/16GB/32GB SSD (available upon request)
GPIO
1 x 8-bit GPIO
 
Watchdog Timer
 
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
 
Power
 
Type
4.75V~20V, 5VSB, VCC_RTC (ATX mode)
4.75V~20V, VCC_RTC (AT mode)
Consumption
63.06 W with i7-3610QE at 2.30GHz and 2x 2GHz DDR3 SODIMM
 
OS Support
 
OS Support
Windows XP Professional x86 & SP3 (32-bit)
Windows XP Professional x64 & SP2 (64-bit)
Windows 7 Ultimate x86 & SP1 (32-bit)
Windows 7 Ultimate x64 & SP1 (64-bit)
Windows 8 Enterprise x86 (32-bit)
Windows 8 Enterprise x64 (64-bit)
 
Environment
 
Temperature
Operating: 0 to 60°C
Storage: -20 to 85°C
Humidity
Operating: 10 to 90% RH
Storage: 10 to 90% RH
MTBF
TBD
 
Mechanism
 
Dimensions
COM Express® Basic 95mm (3.74") x 125mm (4.9")
Compliance
PICMG COM Express® R2.1, Type 6
 
Standards and Certifications
 
Certifications
CE, FCC Class B, RoHS, UL
 
Packing List
 
Packing List
1 CR901-B board
Heat sink with fan: 761-111007-000G
Ordering Info

CR901-B

Part Number :
770-CR9011-000G

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