-front-view.png)
-back-view.png)
-side-view.png)
- COM Express® R2.1, Pin-out Type 6
- Supports Compact and Basic modules
- Multiple displays: VGA, LVDS, DP, eDP
- Rich I/O: 1 x GbE, 4 x USB 3.1, 4 x USB 2.0
- microATX form factor
DFI COM332-B(R.B1) Carrier Board with COM Express R2.1, Pin-out Type 6
-front-view.png)
DFI Official Distributor
Model No:
COM332-B(R.B1)
Highlights:
Downloads:
The DFI COM332-B(R.B1) is a Carrier Board Module with COM Express® R2.1, Pin-out Type 6 which Supports Compact and Basic modules. The DFI COM322-B(R.B1) has Multiple displays: VGA, LVDS, DP, eDP and It also contains Rich I/O: 1 x GbE, 4 x USB 3.1, 4 x USB 2.0 alongside microATX form factor.
Graphics
Display
1 x VGA
1 x LVDS/eDP (eDP available upon request)
3 x DP
1 x eDP/LVDS (LVDS available upon request)
1 x LVDS/eDP (eDP available upon request)
3 x DP
1 x eDP/LVDS (LVDS available upon request)
Expansion
Interface
1 x PCIe x16
4 x PCIe x1
1 x M.2 M Key 2280
1 x SDIO
4 x PCIe x1
1 x M.2 M Key 2280
1 x SDIO
Audio
Audio Codec
Realtek ALC888S-VD2-GR
Rear I/O
Ethernet
1 x GbE (RJ-45)
USB
4 x USB 3.1 (Gen2)
4 x USB 2.0
4 x USB 2.0
Display
3 x DP
Audio
1 x Line-in
1 x Line-out
1 x Mic-in
1 x Line-out
1 x Mic-in
Internal I/O
Serial
2 x Serial Interface Connector (TX/RX)
Display
1 x VGA (2.54mm)
1 x LVDS LCD Panel Connector
1 x LCD/Inverter Power
1 x eDP LCD Panel Connector
1 x LVDS LCD Panel Connector
1 x LCD/Inverter Power
1 x eDP LCD Panel Connector
Audio
1 x Audio (Line-out/Mic-in)
1 x S/PDIF
1 x S/PDIF
SATA
4 x SATA 3.0 (up to 6Gb/s)
DIO
1 x 8-bit DIO
LPC
1 x LPC
SMBus
1 x SMBus
Power
Type
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
12V, VCC_RTC (AT mode)
Connector
4-pin ATX 12V power
24-pin ATX power
24-pin ATX power
RTC Battery
CR2032 Coin Cell
Environment
Temperature
Operating: 0 to 60°C
Storage: -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
488,117 hrs @ 25°C; 253,684 hrs @ 45°C; 136,621 hrs @ 60°C
Calculation Model: Telcordia Issue 2, Method Case 3
Environment: GB, GC – Ground Benign, Controlled
Calculation Model: Telcordia Issue 2, Method Case 3
Environment: GB, GC – Ground Benign, Controlled
Mechanism
Dimensions
microATX Form Factor
244mm (9.6") x 244mm (9.6")
244mm (9.6") x 244mm (9.6")
Compliance
PICMG COM Express® R2.1, Type 6
Basic, Compact Modules
Basic, Compact Modules
Packing List
Packing List
1 COM332-B(R.B1) board
1 Serial ATA data cable (Length: 500mm): 332-553001-005G
1 VGA cable: A81-012000-000G
1 QR (Quick Reference)
1 Serial ATA data cable (Length: 500mm): 332-553001-005G
1 VGA cable: A81-012000-000G
1 QR (Quick Reference)
Compute. Control. Communicate.
Call our experts today for friendly advice on +1 347 719 4508