Avalue ECM-TGUC 11th Gen Intel Core 3.5" Single Board Computer w/ 2 x LAN Ports

Avalue Official Distributor
Avalue Official Distributor
Model No:
ECM-TGUC
Highlights:

 

  • Bottom Layer Soldered Processor
  • Single 260-pin SO-DIMM DRAM Socket, Max, Up to 32GB DDR4 3200MTs (non-ECC Supported)
  • Triple display, 2 x DP++, 1 x 2CH LVDS
  • Expansion Slot, M.2 Key-B, M.2 Key-E, M.2 Key-M
  • Dual Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
  • TPM
  • DC-Input, +12~+24VDC

 

QTY:
Overview

Especially designed for smart IoT, ECM-TGUC is the most cost-effective solution with a wide range of applications. Not only can it help system developers in the fields of industrial automation, transportation, retail, and healthcare, and achieve smart IoT innovations, ECM-TGUC also combines AI accelerator to process complex computation and high workload applications with precision.

Compact and space-saving with ultra-low power consumption and high performance

Avalue’s latest release – the 3.5-inch motherboard ECM-TGUC is thin and lightweight, and measures only 14.6 x 10.1cm, effectively saving space. Featuring 11th Generation Intel Core processor (codename Tiger Lake) and low-power-consumption platform with third-generation 10nm process, its single thread performance increases by 23% while its multi-thread performance increases by 19% as compared to 8th Generation Whisky Lake-U. It also supports low-latency time-critical applications and executes multiple workloads on a single platform. Balancing performance and response, ECM-TGUC’s ultra-low-power-consumption design not only continues on to improve smart terminal devices’ lifespan and function innovation, its low-power-consumption and high-speed processing also allow the ports of multiple devices to communicate synchronously, enabling it to meet the needs of the IoT market, AI, industrial automation, and deep learning.

Highly flexible external expansion slots, dual network connection

3.5-inch embedded single-board computer ECM-TGUC has a set of built-in SO-DIMM memory slots to support up to 32GB Non-ECC DDR4 memory, equipped with three sets of M.2 (Key-E+B+M) expansion slot, supports wireless modules and 4G/LTE/5G communication modules, and uses NvME card to achieve high-speed huge-volume transmission. Fully integrating into the field of IoT, ECM-TGUC is equipped with a diverse array of I/O interfaces, up to eight sets of USB port (3 x USB 3.2 Gen.2 and 5 x USB 2.0), six sets of com port (1 x RS-232/422/485 and 5 x RS232) and a SATA III connector. Furthermore, ECM-TGUC has both 2.5GbE and 1GbE Ethernet ports to allow fast synchronization of edge devices with the use of high-bandwidth and stable network connection, achieving seamless coordination in industrial automation. Supporting 1 x 2CH LVDS and 2 x DP++ displays, it ensures virtually no delay or dropped frames, making it ideal for graphics-intensive applications, multimedia centre, industrial control system and many embedded applications.

Excellent thermal solution, blueprint for entire product line

As opposed to the conventional practice of placing all the processor, chipset and slots in the front of the single board computer, which can cause crowding and generates massive waste heat, potentially decreasing performance of system operation and causing data damage, Avalue ECM-TGUC’s processor and chipset are mounted on the underside of the motherboard, helping to lower temperature and freeing up more space on the motherboard for flexible integration. Avalue also offers optional CPU thermal solution. Copper skived fin heat sink quickly absorbs heat energy released during CPU operation and completely transfers and disperses the heat through the fins. Easy to install and secured with screws, it provides high performance thermal solution for limited spaces.

ECM-TGUC supports Windows 10 and Linux operating systems, and operates within a standard temperature range of 0°C~60°C. Beginning with its first-generation TGU board, which will be integrated into its Box PC and Panel PC product line for the field of industrial automation, Avalue plans to develop a series of high-performance, low-energy-consuming embedded industrial solution to satisfy requirements in the embedded market, including industrial automation, machine vision, self-service platform, digital signage and medical imaging, and smart IoT applications.

 

Main Features
System Information    
Processor Onboard 11th Gen. Intel Core SoC i5/i3 BGA Processor
Intel Core i3-1115G4 (up to 3.0GHz, dual-core, 6M Cache, TDP: 28/15/12W)
Intel Core i5-1135G7 (up to 2.4GHz, quad-core, 8M Cache, TDP: 28/15/12W)
 
System Memory Single 260-pin DDR4 SODIMM Socket, Supports Up to 32GB DDR4 3200MTs SDRAM (non ECC only)  
I/O Chipset NCT6126  
BIOS Information AMI BIOS, 256Mbit SPI Flash ROM  
Watchdog Timer H/W Reset, 1sec. ~ 65535sec and 1sec. or 1min./step  
H/W Status Monitor CPU & system temperature monitoring Voltages monitoring  
TPM Onboard NuvoTon NPCT754AADYX support TPM 2.0 (BOM optional) co lay Infineon SLB9670VQ2.0 & Z32H330TC-SQN-755  
Expansion    
Expansion 1 x M.2 Type M 2280 (with 1 x PCI-e Gen4 x4)
1 x M.2 Type B 3042/3052/2242 (with SATA and USB2.0, USB 3.0, with 1 x SIM card slot, support WWAN+GNSS or SSD)
* Only supports one SIM card (co-lay 1 x 10pin FPC connector for uSIM card adapter) 3.8V for 5G
1 x M.2 Key E 2230 support WiFi module (1 x PCI-e x 1 & USB 2.0 Signal))
 
Storage    
Storage 1 x M.2 (Key-B, 2242)
1 x M.2 (Key-M, 2280)
1 x SATA III
 
I/O    
USB Port 3 x USB 3.2 Gen 2x1  
  5 x USB 2.0  
COM Port 1 x RS-232/422/485  
  5 x RS232  
SATA 1 x SATA III  
DIO 1 x 2 x 6 pin, pitch 2.00mm connector for GPIO: 8 bits & +3.3S Level  
Other 2 x LAN  
Display    
Graphic Chipset Intel Tiger Lake UP3 SoC Processor integrated Gen12 graphics  
Spec. & Resolution DP++ Max resolution 4096x2160@60Hz
LVDS Max resolution 1920 x 1080 Dual channel 18/24-bits
 
Multiple Display Triple Display  
LVDS 1 x LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS (Chrontel CH7513A-BF eDP to LVDS)  
Audio    
Audio Codec RealTek ALC888S-VD2-GR  
Audio Interface Mic-In, Line-In, Line-Out in pin header  
Certifications    
Certification Information CE  
  FCC Class B  
Ethernet    
LAN Chipset Intel I219LM Gigabit Ethernet
Intel I225V Gigabit Ethernet
 
     
Ethernet Interface 1 x 10/100/1000/2.5G Base-Tx GbE compatible
1 x 10/100/1000 Base-Tx GbE compatible
 
     
LAN Port 2 x RJ-45  
Mechanical & Environmental    
Operating Temperature Standard Temperature: 0°C ~ 60°C (-4~140°F) with 0.5m/s air flow  
Storage Temperature -40°C ~ 85°C (-40°F ~ 185°F)  
Operating Humidity 40°C @ 95% Relative Humidity, Non-condensing  
Weight 0.44lbs (0.2kg)  
Vibration Test 1.5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 30min/Axis, 3 Axis  
Shock Test 10G, IEC 60068-2-27, Half Sine, 11ms, Z Axis  
Drop Test ISTA 2A, IEC-60068-2-32 Test : Ed, 1 Corner, 3 Edges, 6 Faces  
Power Requirement DC in +12V ~ +24V  
ACPI Single power ATX Support S0,S3, S4, S5
ACPI 5.0 Compliant
 
     
Power Mode AT/ATX (Default Setting: AT)  
Dimension (L x W) 5.7" x 4" (146mm x 101mm)  
Software Support    
OS Information Win 10  
  Linux  
Ordering Information    
Ordering Information ECM-TGUC-15-A1R, ECM-TGUC/i31115G4/1SATA/6COM/8USB/15W/A1
ECM-TGUC-35-A1R, ECM-TGUC/i51135G7/1SATA/6COM/8USB/15W/A1
 
     
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