DFI HR900-B COM Express Basic Type 2 Module Supporting 2nd Gen Intel Core i7


DFI HR900-B COM Express Basic Type 2 Module Supporting 2nd Gen Intel Core i7


  • 3rd/2nd Gen Intel® Core™, Intel® QM67 Chipset
  • Rich I/O: 1 Intel GbE, 8 x USB 2.0
  • Multiple expansion: 1 PCIe x16, 4 x SATA, 1 x LPC, 1 x IDE, 1 x SMBus
  • 1 x VGA, 1 x LVDS, 2 x DDI (HDMI/DP/SDVO)
  • Dual channel DDR3 1600MHz SODIMM up to 16GB
  • 7-Year CPU Life Cycle Support Until Q3′ 18 (Based on Intel IOTG Roadmap)

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DFI has launched the COM Express basic type 2 form factor HR900-B mobile platform offering higher processing performance, superior graphics display support, and evolutionary memory system and I/O interface improvements. This embedded module uses an Intel QM67 Express chipset supporting the quad core 2nd Generation Intel Core i7-2710QE processor and dual core 2nd Generation Intel Core i5-2510E processor on 32nm process technology. The graphics and processor cores are integrated on a single monolithic die and provide Intel HD graphics support for DVI-I, LVDS and VGA display interfaces. The 32nm Intel Core microarchitecture provides higher performance at lower power than previous generation processors, and includes the first mobile quad-core processor with an integrated graphics core. Performance is further increased through the introduction of Intel Advanced Vector Extensions (Intel AVX) to the instruction set, providing acceleration of complex audio, video, and image processing.In addition, this new platform supports Intel Hyper-Threading and improved Intel Turbo Boost Technology 2.0, which enables each processor core to handle two instruction threads and dynamically increase the clock speed when all cores are not fully utilized. This provides increased performance over the previous generation platform for both multi-core and non-multi-core optimized application programs. The combination of Intel Hyper-Threading, Intel Turbo Boost Technology improvements, and the new three-level cache subsystem insures higher performance at reduced power consumption across a broad-spectrum of embedded processing applications.Support is provided for up to 8GB of DDR3 1066/1333 MHz dual-channel system memory, two Gigabit LAN controllers, and up to four display ports using carrier based DVI, HDMI, LVDS, and VGA display interfaces. The integrated Intel HD graphics engine supports six graphics execution units with dynamic turbo boost to accelerate video processing, and Intel Clear Video Technology providing advanced imaging capability for Blu Ray and other high definition video processing.The HR900-B also supports Intel High Definition Audio, two Serial ATA ports with speed up to 3Gb/s, two Serial ATA ports with speed up to 6Gb/s, eight USB 2.0 host controller ports, one PCI Express x16 expansion interfaces (Gen 2), 5 PCI Express x1 expansion interfaces, and 4 PCI expansion interfaces.This embedded COM Express basic type 2 form factor module is ideal for applications requiring a stable revision-controlled platform such as industrial control automation, digital signage, kiosk, medical equipment, and gaming embedded applications.

Ordering Info


Part Number : 777-HR9002-000G


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System   Processor Socket G2 988B for:– 3rd Generation Intel® Core™ processors (22nm process technology)Intel® Core™ i7-3610QE (6M Cache, up to 3.3 GHz); 45WIntel® Core™ i5-3610ME (3M Cache, up to 3.3 GHz); 35WIntel® Core™ i3-3120ME (3M Cache, 2.4 GHz); 35W– 2nd Generation Intel® Core™ processors (32nm process technology)Intel® Core™ i7-2710QE (6M Cache, up to 3.0 GHz); 45WIntel® Core™ i5-2510E (3M Cache, up to 3.1 GHz); 35WIntel® Core™ i3-2330E (3M Cache, 2.2 GHz); 35WIntel® Celeron® B810 (2M Cache, 1.6 GHz); 35W Chipset Intel® QM67 Chipset Memory Two 204-pin SODIMM up to 16GB Dual Channel DDR3 1600MHz BIOS UEFI 64Mbit SPI   Graphics   Controller Intel® HD Graphics 4000 (3rd generation processors) Intel® HD Graphics 3000 (2nd generation processors) Intel® HD Graphics (Intel® Celeron™ processors) Feature DirectX Video Acceleration (DXVA) for accelerating video processing – Full AVC/VC1/MPEG2 HW Decode Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors) Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors) Display 1 x VGA1 x LVDS 2 x DDI(HDMI/DP/SDVO)VGA: resolution up to 2048×1536 @ 75HzLVDS: dual channel 36/48-bit, resolution up to 1920×1200 @ 60HzHDMI/DP: resolution up to 1920×1200 @ 60Hz   Expansion   Interface 1 PCIe x165 PCIe x14 PCI1 x LPC1 x IDE1 x SMBus   Audio   Interface HD Audio   Ethernet   Controller 1 x Intel® 82579LM (10/100/1000Mbps)   I/O   USB 8 x USB 2.0 SATA 2 x SATA 3.0 (up to 6Gb/s) 2 x SATA 2.0 (up to 3Gb/s) DIO 1 x 8-bit DIO   Watchdog Timer   Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds   Power   Type 4.75V~20V, 5VSB, VCC_RTC (ATX mode) 4.75V~20V, VCC_RTC (AT mode) Consumption 54.70 W with i7-2710QE at 2.10GHz and 2x 4GB DDR3 SODIMM   OS Support   OS Support Windows XP Professional x86 & SP3 (32-bit)Windows XP Professional x64 & SP2 (64-bit) Windows 7 Ultimate x86 & SP1 (32-bit)Windows 7 Ultimate x64 & SP1 (64-bit)Windows 8 Enterprise x86 (32-bit) Windows 8 Enterprise x64 (64-bit)   Environment   Temperature Operating: 0 to 60°CStorage: -20 to 85°C Humidity Operating: 10 to 90% RH Storage: 10 to 90% RH MTBF TBD   Mechanism   Dimensions COM Express® Basic 95mm (3.74″) x 125mm (4.9″) Compliance PICMG COM Express® R1.0, Type 2   Standards and Certifications   Certifications CE, FCC Class B, RoHS, UL   Packing List   Packing List 1 HR900-B board1 Drivers/utilities disk