DFI GH960 Basic Type 6 with AMD Ryzen V1000/R1000 & Dual Channel DDR4 up to 32GB


DFI GH960 Basic Type 6 with AMD Ryzen V1000/R1000 & Dual Channel DDR4 up to 32GB


  • Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
  • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI;Supports three independent displays
  • DP++ resolution supports up to 4096×2304 @ 60Hz
  • Multiple expansion: 1 PCIe x8, 7 PCIe x1
  • Rich I/O: 1 Intel GbE, 4 x USB 3.1, 8 x USB 2.0
  • 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap)

Customisation Service

We can configure this device for you to your exact specification. So we can provide you with the best possible service, please let us know a little about your project if you need this service.



The DFI GH960 is a COM Express Basic Type 6 Module that includes Dual Channel DDR4 2400/3200MHz SODIMM up to 32GB. Along with Four Display Ports: VGA*/DDI and LVDS*/eDP + 2 DDI ; which Supports Three Independent Displays. The GH960 has DP++ Resolution which supports up to 4096×2304 at 60Hz. It Contains Multiple Expansion: 1 PCIe x8 and 7 PCIe x1. And Rich I/O: 1 x Intel GbE, 4 x USB 3.1 ans 8 USB 2.0. Furthermore, This Product entails a 10-Year CPU Life Cycle Support Until Q2′ 27. 

Ordering Info

carrier board kit


Heat spreader (Height: 11mm)



System Integration

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System   Processor AMD® Ryzen™ Embedded V1807, Quad Core, 2MB Cache, 11 CU, 3.35GHz (3.8GHz), 35-54WAMD® Ryzen™ Embedded V1756, Quad Core, 2MB Cache, 8 CU, 3.25GHz (3.6GHz), 35-54WAMD® Ryzen™ Embedded V1605, Quad Core, 2MB Cache, 8 CU, 2.0GHz (3.6GHz), 12-25WAMD® Ryzen™ Embedded V1202, Dual Core, 1MB Cache, 3 CU, 2.3GHz (3.2GHz), 12-25WAMD® Ryzen™ Embedded R1606G, Dual Core, 1MB Cache, 3 CU, 2.6GHz (3.5GHz), 12-25WAMD® Ryzen™ Embedded R1505G, Dual Core, 1MB Cache, 3 CU, 2.4GHz (3.3GHz), 12-25W Memory Two 260-pin SODIMM up to 32GBDual Channel DDR4 up to 2400/3200MHz BIOS Insyde SPI 64Mbit   Graphics   Controller AMD® Radeon™ Vega Graphics Feature OpenGL 4.5, DirectX 12, OpenCL 2.1HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9 Display 1 x VGA/DDI (DDI available upon request)1 x LVDS/eDP (eDP available upon request)2 x DDI (HDMI/DVI/DP++)VGA: resolution up to 1920×1200 @ 60HzLVDS: dual channel 24-bit, resolution up to 1920×1200 @ 60HzeDP: resolution up to 3840×2160 @ 60 HzHDMI: resolution up to 2560×1600 @ 60Hz or 4096×2160 @ 24HzDVI: resolution up to 1920×1200 @ 60HzDP++: resolution up to 4096×2304 @ 60Hz Triple Displays VGA + LVDS + DDI or VGA + DDI 1 + DDI 2 eDP + 2 DDI (available upon request)   Expansion   Interface HD Audio   Ethernet   Controller 1 x Intel® I210AT with iAMT12.0 PCIe (10/100/1000Mbps) (normal temp.) or1 x Intel® I210IT with iAMT12.0 PCIe (10/100/1000Mbps) (wide temp.)   I/O   USB 4 x USB 3.18 x USB 2.0 SATA 1 or 2 x SATA 3.0 (up to 6Gb/s)RAID 0/1 DIO 1 x 8-bit DIO (Default 4 inputs and 4 outputs)   Watchdog Timer   Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds   Security   TPM TPM1.2/2.0 (Available Upon Request)   Power   Type 12V, 5VSB, VCC_RTC (ATX mode)12V, VCC_RTC (AT mode) Consumption TBD   OS Support   OS Support Windows: Windows 10 IoT Enterprise 64-bitLinux   Environment   Temperature Operating: 0 to 60°C, -40 to 85°C (with cooler)Storage: -40 to 85°C Humidity Operating: 5 to 90% RHStorage: 5 to 90% RH MTBF TBD   Mechanism   Dimensions COM Express® Basic95mm (3.74″) x 125mm (4.9″) Compliance PICMG COM Express® R3.0, Type 6   Packing List   Packing List 1 GH960 board1 DVD1 Cooler (Height: 36.58mm): TBD