Nexcom TCA 5170B Intel Xeon SoC 1U Rackmount uCPE w/ 8x GbE RJ45, 4x 10GbE Fiber

Nexcom TCA 5170B Intel Xeon SoC 1U Rackmount uCPE w/ 8x GbE RJ45, 4x 10GbE Fiber

TCA 5170B

  • Intel Xeon D-2177NT SoC, BGA type
  • 8 x DDR4-2666 RDIMM
  • 1 x 2.5 SSD, 1 x M.2 2280
  • 8 x GbE RJ45 & 4 x 10GbE fiber
  • 2 x LAN modules
  • Supports Intel QAT
  • Redundant power supply
  • Intel Select Solution for uCPE (CentOS)


The Nexcom 1U rackmount uCPE TCA 5170B helps telecom companies build virtualization environments based on Intel Xeon D-2177NT processor (Skylake). Packing excellent multi-core CPU performance, accelerated data cryptography with Intel QAT technology, and server-grade LAN functions into a small form factor, this 1U rackmount uCPE, an Intel Select Solution for uCPE, creates virtualized environments for flexible VNF deployments in enterprises and branch offices


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Main Board Intel® Xeon® Skylake-D SoC, BGA typeD-2177NT, 14 cores w/ QAT
Main Memory 8 x DDR4 2666 RDIMM sockets, up to 256GB
Storage Device 1 x 2.5” internal SSD/HDD bay1 x M.2 2280 M key, supports SATA and PCIe x4 signal
Interface-External Button: Power & ResetLED: Power/HDD/2 x GPIO1 x USB 3.0 port1 x Micro USB type console8 x GbE RJ45 ports2 x LAN bypass pairs4 x 10GbE fiber ports2 x PCIe x8 LAN module slots1 x Management port4 x SMA connectors for antennas3 x Fixed smart fans2 x Power inletsLCM module (optional)
Interface-Internal 1 x M.2 2230 E key1 x M.2 3042 B key with SIM slot
Power 450W 1+1 redundant power supply
Dimensions and Weight Chassis dimension (mm): 438 x 480 x 44Package dimension(mm): 632 x 567 x 203Without packing: 8kgWith packing: 12kg
Environment Operating temperature: 0°C~40°CStorage temperature: -20°C~80°CRelative humidity: 10%~90%, non-condensing
Certifications CE/FCC Class A