Nexcom TCA 5170B Intel Xeon SoC 1U Rackmount uCPE w/ 8x GbE RJ45, 4x 10GbE Fiber
Nexcom TCA 5170B Intel Xeon SoC 1U Rackmount uCPE w/ 8x GbE RJ45, 4x 10GbE Fiber
TCA 5170B
- Intel Xeon D-2177NT SoC, BGA type
- 8 x DDR4-2666 RDIMM
- 1 x 2.5 SSD, 1 x M.2 2280
- 8 x GbE RJ45 & 4 x 10GbE fiber
- 2 x LAN modules
- Supports Intel QAT
- Redundant power supply
- Intel Select Solution for uCPE (CentOS)
Details
The Nexcom 1U rackmount uCPE TCA 5170B helps telecom companies build virtualization environments based on Intel Xeon D-2177NT processor (Skylake). Packing excellent multi-core CPU performance, accelerated data cryptography with Intel QAT technology, and server-grade LAN functions into a small form factor, this 1U rackmount uCPE, an Intel Select Solution for uCPE, creates virtualized environments for flexible VNF deployments in enterprises and branch offices
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Specification
| Main Board | Intel® Xeon® Skylake-D SoC, BGA typeD-2177NT, 14 cores w/ QAT |
| Main Memory | 8 x DDR4 2666 RDIMM sockets, up to 256GB |
| Storage Device | 1 x 2.5” internal SSD/HDD bay1 x M.2 2280 M key, supports SATA and PCIe x4 signal |
| Interface-External | Button: Power & ResetLED: Power/HDD/2 x GPIO1 x USB 3.0 port1 x Micro USB type console8 x GbE RJ45 ports2 x LAN bypass pairs4 x 10GbE fiber ports2 x PCIe x8 LAN module slots1 x Management port4 x SMA connectors for antennas3 x Fixed smart fans2 x Power inletsLCM module (optional) |
| Interface-Internal | 1 x M.2 2230 E key1 x M.2 3042 B key with SIM slot |
| Power | 450W 1+1 redundant power supply |
| Dimensions and Weight | Chassis dimension (mm): 438 x 480 x 44Package dimension(mm): 632 x 567 x 203Without packing: 8kgWith packing: 12kg |
| Environment | Operating temperature: 0°C~40°CStorage temperature: -20°C~80°CRelative humidity: 10%~90%, non-condensing |
| Certifications | CE/FCC Class A |
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