DFI SH960-HM170 Basic Type 6 with 6th Gen Intel Core Processor, Intel HM170

DFI Official Distributor
DFI Official Distributor
Model No:
SH960-HM170
Highlights:
  • 6th Gen Intel® Core™, Intel® HM170 Chipset
  • Rich I/O: 1 Intel GbE, 4 x USB 3.0, 8 x USB 2.0
  • Multiple expansion: 1 PCIe x16, 8 PCIe x1
  • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
  • Dual channel DDR4 2133MHz SODIMM up to 32GB
  • 15-Year CPU Life Cycle Support Until Q4' 29 (Based on Intel IOTG Roadmap)
QTY:
Overview

The DFI has Introduced the SH960-HM170 COM Express Type 6 module powered by the 6th Generation Intel® Core™ processor family (codename Skylake). The Mobile-based module features enhanced graphics performance and high computing while ULT-based module features low power and fanless design making them well suited for industrial application in gaming, medical, digital signage, and factory automation. With more and more requirements in the gaming market, gaming machine manufacturers continue to search for the right solution to obtain rich immersive graphics and performance that end users come to expect today. Aimed at the application, DFI developed COM Express Basic based on mobile platform featuring super-fast 2133 DDR4 memory up to 32 GB for faster data transfer and 3 independent displays with high resolution (HDMI/DP++/eDP supports up to 4K x 2K) for greater gaming experience. 

Main Features
System
 
Processor
6th Generation Intel® Core™ Processors, BGA 1440
Intel® Core™ i7-6820EQ Processor, Quad Core, 8M Cache, 2.8GHz (3.5GHz), 45W
Intel® Core™ i7-6822EQ Processor, Quad Core, 8M Cache, 2.0GHz (2.8GHz), 25W
Intel® Core™ i5-6440EQ Processor, Quad Core, 6M Cache, 2.7GHz (3.4GHz), 45W
Intel® Core™ i5-6442EQ Processor, Quad Core, 6M Cache, 1.9GHz (2.7GHz), 25W
Intel® Core™ i3-6100E Processor, Dual Core, 3M Cache, 2.7GHz, 35W
Intel® Core™ i3-6102E Processor, Dual Core, 3M Cache, 1.9GHz, 25W
Intel® Celeron® Processor G3900E, Dual Core, 2M Cache, 2.4GHz, 35W
Intel® Celeron® Processor G3902E, Dual Core, 2M Cache, 1.6GHz, 25W
Chipset
Intel® HM170 Chipset
Memory
Two 260-pin SODIMM up to 32GB Dual Channel DDR4 2133MHz
BIOS
Insyde SPI 128Mbit
 
Graphics
 
Controller
Intel® HD Graphics GT Series
Feature
OpenGL up to 4.4, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9
Display
1 x VGA/DDI (DDI available upon request)
1 x LVDS/eDP (eDP available upon request)
2 x DDI (HDMI/DVI/DP++)
VGA: resolution up to 1920x1200 @ 60Hz
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz
HDMI: resolution up to 4096x2160 @ 24Hz or 2560x1600 @ 60Hz
DVI: resolution up to 1920x1200 @ 60Hz
DP++/eDP: resolution up to 4096x2304 @ 60Hz
Triple Displays
VGA + LVDS + DDI or VGA + DDI1 + DDI2
eDP + 2 DDI (available upon request)
 
Expansion
 
Interface
1 x PCIe x16 or 2 x PCIe x8 (Gen 3)
8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 (Gen 3)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)
 
Audio
 
Interface
HD Audio
 
Ethernet
 
Controller
1 x Intel® I219LM with iAMT11.0 PCIe (10/100/1000Mbps)
 
I/O
 
USB
4 x USB 3.0
8 x USB 2.0
SATA
4 x SATA 3.0 (up to 6Gb/s) RAID 0/1/5/10
DIO
1 x 8-bit DIO
 
Watchdog Timer
 
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
 
Security
 
TPM
Available Upon Request
 
Power
 
Type
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Consumption
TBD
 
OS Support
 
OS Support
Windows 7 (/WES7) 32/64-bit
Windows 8.1 (64-bit)
Windows 10 IoT Enterprise 64-bit
Debian 8 (with VESA graphic driver)
CentOS 7 (with VESA graphic driver)
Linux
 
Environment
 
Temperature
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
663,394hrs @ 25°C; 334,612 hrs @ 45°C; 193,307 hrs @ 60°C excluding accessories
Calculation Model: Telcordia Issue 2, Method Case 3
Environment: GB, GC – Ground Benign, Controlled
 
Mechanism
 
Dimensions
COM Express® Basic 95mm (3.74") x 125mm (4.9")
Compliance
PICMG COM Express® R2.1, Type 6
 
Standards and Certifications
 
Certifications
CE, FCC
 
Packing List
 
Packing List
1 SH960-HM170 board
1 Cooler (Height: 36.58mm): A71-111026-000G
Ordering Info

SH960-HM170TS-6100E770-SH9604-800G

Cooler, Intel Core i3-6100E, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, -40 to 85°C

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