DFI SH960-CM236/QM170 Type 6 with 6th Gen Intel Core & Intel CM236/QM170 Chipset

DFI, a leading provider offering a wide range of embedded products for industrial applications, its new products based on 6th Gen Intel® Core™ processor family (codename Skylake), and it includes the following: 12 industrial motherboards, 2 single board computers (SBC), 4 COM Express modules and 1 compact ULT-based embedded system. These latest Intel® Core™ processors are built on Intel’s new 14nm technology using 2nd generation 3-D tri-gate transistors and deliver blazing fast computing and graphics performance. These new 19 products come with LGA/BGA-package processors designed with the Intel® C236/100 Series chipsets to target the IoT (Internet of Things) smart computing solutions that require scalable processing power, enhanced display capabilities, and product stability. DFI, as an associate member of the Intel® Internet of Things Solutions Alliance, works closely with Intel on development of next-generation standards-based building blocks, platforms and solutions for the embedded market segments. To ensure our customers stay ahead of the competition, DFI has deployed a complete product line applying the 6th Gen Intel® Core™ processor. DFI’s 6th Gen Intel® Core™ processor-based boards support up to 3 independent video streams and increased display resolutions to provide a stunning Ultra HD 4K media experience. This new generation platform allows the embedded boards to drive breathtaking 3D video content and multiple displays simultaneously for a variety of graphics and compute-intensive solutions including medical imaging, gaming, digital signage, etc. The new embedded solutions are also able to support DDR4 memory with optional ECC capability which offers customers optimizing speed and power efficiency to process data faster and draw on the improved responsiveness. Taking the advantages of DDR4 memory, the motherboards can satisfy the ever-increasing workload demands of data centers and enterprise servers nowadays. A new version of Intel® vPro™ Technology features, such as Intel® Active Management Technology 11.0, enable enterprises to remotely manage and repair their workstations or servers in real time, thereby increasing efficiency. Furthermore, Intel® VT and Intel® TXT improve security and reliability by allowing critical applications like bank transaction to run safely in isolation and preventing unauthorized software from starting up. With this new platform, the DFI’s industrial motherboards are expected to satisfy an array of embedded vertical markets and smart solutions in IoT networks with high speed I/O, cost-efficient, excellent security and manageability features.

SH960-CM236BS-1515M

770-SH9604-D00G

Cooler, Intel Xeon E3-1515M v5, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C

SH960-QM170TS-6820EQ

770-SH9604-A00G

Heat Spreader, Intel Core i7-6820EQ, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, -40 to 85°C

SH960-CM236BS-6100E

770-SH9604-E00G

Cooler, Intel Core i3-6100E, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C

SH960-CM236BS-3900E

770-SH9604-F00G

Cooler, Intel Celeron G3900E, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C

SH960-QM170BS-6440EQ

770-SH9604-600G

Cooler, Intel Core i5-6440EQ, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C

SH960-QM170BS-6820EQ

770-SH9604-400G

Cooler, Intel Core i7-6820EQ, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C

SH960-QM170BS-6822EQ

770-SH9604-500G

Cooler, Intel Core i7-6822EQ, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C

SH960-QM170BS-6442EQ

770-SH9604-700G

Cooler, Intel Core i5-6442EQ, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C