- 4th Gen Intel® Core™, Intel® HM86 Chipset
- Rich I/O: 1 Intel GbE, 2 x USB 3.0, 8 x USB 2.0
- Multiple expansion: 1 PCIe x16, 4 x SATA, 1 x LPC, 1 x I2C, 1 x SMBus
- 1 x VGA, 1 x LVDS, 3 x DDI
- Dual channel DDR3L 1600MHz SODIMM up to 16GB
- 7-Year CPU Life Cycle Support Until Q3' 19 (Based on Intel IOTG Roadmap)
DFI HM960-HM86 COM Basic Type 6 4th Gen Intel Core Processor, Intel HM86 Chipset


DFI, a leading provider of embedded computers, launches a new Type 6 COM Express Basic module, the HM960-HM86, in its mobile-based Intel® HM86 product line providing low-power consumption and higher performance. This COM Express Basic module is powered by the BGA 1364 packaging technology supporting the latest 4th generation Intel® Core™ processor family. The enhancements in CPU performance, media and graphics capabilities, security and power efficiency in the 4th generation Intel® Core™ processor family are driving innovation. In order to provide smooth flash playback and rich 2D/3D graphics with high quality playback, HM960-QM87 is equipped with the integrated Intel® HD Graphics 4600 engine. Targeted at gaming, media, and automation applications, this model offers enhanced graphics performance via the 1 VGA, 1 LVDS, and 3 DDI interfaces, allowing you to choose the best combination to suit a variety of requirements. The new COM Express Basic module features 2 DDR3L SODIMM sockets that support up to 16GB. Offering persistent data storage, the optional onboard SSD is a lot faster than conventional rotating hard disks. This low-power module taking full advantage of the Intel® HM86 express chipset provides multiple expansion interfaces, including 1 PCIe x16, 7 PCIe x1, 1 LAN, 10 USB, 4 SATA, 1 LPC, 1 SMBus , 1 I2C, 2 serial, 4-bit input and 4-bit output GPIO for device controls. These flexible interfaces allow your systems to process a higher data load and provide faster loading of frequently used applications. HM960-HM86, the new COM Express Basic module with expansive features, are the ideal choices for a whole range of applications such as gaming machine, medical equipment, industrial control automation, security & surveillance, smart grid, ATM, and POS.
Intel® Core™ i7-4700EQ, 6M Cache, 2.4GHz (3.4GHz), 47W
Intel® Core™ i5-4400E, 3M Cache, 2.7GHz (3.3GHz), 37W
Intel® Core™ i5-4402E, 3M Cache, 1.6GHz (2.7GHz), 25W
Intel® Core™ i3-4100E, 3M Cache, 2.4GHz, 37W
Intel® Core™ i3-4102E, 3M Cache, 1.6GHz, 25W
Dual Channel DDR3L 1600MHz
1 x LVDS
3 x DDI (HDMI/DVI/DP)
VGA: resolution up to 2048x1536 @ 75Hz
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz
HDMI: resolution up to 4096x2160 @ 24Hz or 2560x1600 @ 60Hz
DVI: resolution up to 1920x1200 @ 60Hz
DP: resolution up to 3840x2160 @ 60Hz
7 x PCIe x1
1 x LPC
1 x I2C
1 x SMBus
2 x Serial (TX/RX)
8 x USB 2.0
2 x SATA 2.0 (up to 3Gb/s)
12V, VCC_RTC (AT mode)
Windows 7 Ultimate x86 & SP1 (32-bit)
Windows 7 Ultimate x64 & SP1 (64-bit)
Windows 8 Enterprise x86 (32-bit)
Windows 8 Enterprise x64 (64-bit)
Storage: -20°C to 85°C
Storage: 5 to 90% RH
Calculation model: Telcordia Issue 2, Method I Case 3
Environment: GB, GC – Ground Benign, Controlled
Heat spreader with heat sink and fan: 761-HSWMBL-000G