- COM Express® R2.0, Pin-out Type 2
- Supports Compact/Basic modules
- Multiple displays: 1 x LVDS, 1 x VGA
- Rich I/O: 1 x GbE, 8 x USB 2.0, 4 x COM
- microATX form factor
The DFI COM330-B is a Carrier Board with COM Express® R2.0, Pin-out Type 2 which Supports Compact/Basic modules. The DFI COM330-B has Multiple displays: 1 x LVDS, 1 x VGA and Rich I/O: 1 x GbE, 8 x USB 2.0, 4 x COM alongside microATX form factor.
Graphics
Display
1 x VGA
1 x LVDS
1 x LVDS
Expansion
Interface
1 x PCIe x16 (Gen 3)
1 x PCIe x4 (Gen 2)
1 x Mini PCIe
2 x PCI
1 x PCIe x4 (Gen 2)
1 x Mini PCIe
2 x PCI
Audio
Audio Codec
Realtek ALC886
Rear I/O
Ethernet
1 x GbE (RJ-45)
Serial
3 x RS232 serial ports
USB
4 x USB 2.0
PS/2
2 x PS/2
Display
1 x VGA
Audio
1 x Line-in
1 x Line-out
1 x Mic-in
1 x Line-out
1 x Mic-in
Internal I/O
Serial
1 x RS232 Serial Interface Connector
USB
4 x USB 2.0
Display
1 x LVDS LCD Panel Connector
1 x LCD/Inverter Power
1 x LCD/Inverter Power
Audio
1 x Audio (Line-out/Mic-in)
1 x S/PDIF
1 x S/PDIF
SATA
2 x SATA 3.0 (up to 6Gb/s)
2 x SATA 2.0 (up to 3Gb/s)
2 x SATA 2.0 (up to 3Gb/s)
DIO
1 x 8-bit DIO
LPC
1 x LPC
SMBus
1 x SMBus
I2C
1 x I2C
Power
Type
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
12V, VCC_RTC (AT mode)
Connector
4-pin ATX 12V power
24-pin ATX power
24-pin ATX power
Environment
Temperature
Operating: 0 to 60°C
Storage: -20 to 85°C
Storage: -20 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
microATX Form Factor 244mm (9.6") x 244mm (9.6")
Compliance
PICMG COM Express® R2.0, Type 2
Basic, Compact Modules
Basic, Compact Modules
Packing List
Packing List
1 COM330-B board
2 Serial ATA data cables
1 USB port cable (with bracket)
1 COM port cable (with bracket)
1 QR (Quick Reference)
1 DVD
2 Serial ATA data cables
1 USB port cable (with bracket)
1 COM port cable (with bracket)
1 QR (Quick Reference)
1 DVD
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