- 2nd Gen AMD® R-Series, AMD® A77E
- Rich I/O: 1 Intel GbE, 4 x USB 3.0, 8 x USB 2.0
- Multiple expansion: 1 PCIe x16, 7 PCIe x1, 1 x LPC, 1 x I2C, 1 x SMBus
- Four independent displays: VGA*/DDI + LVDS*/eDP + 2 DDI
- Dual Channel DDR3L 1866MHz SODIMM up to 16GB
- 10-Year CPU Life Cycle Support Until Q3' 23 (Based on AMD Roadmap)
DFI BE960 COM Basic Type 6 with 2nd Gen AMD R-Series,AMD A77E & DDR3L up to 16GB


The DFI BE960 is a COM Express Basic Type 6 with 2nd Generation AMD R-Series, AMD A77E. This module has Rich I/O ( 1 x Intel GbE, 4 x USB 3.0 and 8 USB 2.0 ), Multiple Expansion ( 1PCIe x16, 7 PCIe x1, 1 x LPC, 1 x I2C and 1 x SMBus ) and Four Independent Displays ( VGA*/DDI + LVDS*/eDP + 2 DDI ). It also includes Dual Channel DDR3L 1866MHz SODIMM up to 16GB.
AMD® RX-427BB, Quad Core, 4M Cache, 2.7GHz (3.6GHz), 35W
AMD® RX-425BB, Quad Core, 4M Cache, 2.5GHz (3.4GHz), 35W
HW Decode: H.264, MPEG2, VC-1, MPEG4 (DivX), WMV
HW Encode: H.264
1 x LVDS/eDP (eDP available upon request)
2 x DDI (HDMI/DVI/DP++)
VGA: resolution up to 2048x1536 @ 75Hz
LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz
eDP: resolution up to 1920x1080 @ 60Hz
HDMI: resolution up to 4096x2160 @ 24Hz or 1920x1080 @ 60Hz
DVI: resolution up to 1920x1200 @ 60Hz
DP++: resolution up to 3840x2160 @ 30Hz
eDP + 3 DDI
7 x PCIe x1 or 1 x PCIe x4 + 3 x PCIe x1 (Gen 2)
1 x LPC
1 x I2C
1 x SMBus
2 x Serial (TX/RX)
8 x USB 2.0
12V, VCC_RTC (AT mode)
Max.: RX-427BB: 12V @ 3.35A (40.18Watt)
Windows 7 (/WES7) 32/64-bit
Windows 10 IoT Enterprise 64-bit
Debian 8 (with VESA graphic driver)
CentOS 7 (with VESA graphic driver)
Linux
Storage: -40 to 85°C
Storage: 10 to 90% RH
Calculation Model: Telcordia Issue 2, Method Case 3
Environment: GB, GC – Ground Benign, Controlled
1 Cooler (Height: 36.58mm): A71-111026-000G