DFI SH960-CM236/QM170 Type 6 with 6th Gen Intel Core & Intel CM236/QM170 Chipset


DFI SH960-CM236/QM170 Type 6 with 6th Gen Intel Core & Intel CM236/QM170 Chipset


  • 6th Gen Intel® Core™, Intel® CM236/QM170 Chipset
  • Rich I/O: 1 Intel GbE, 4 x USB 3.0, 8 x USB 2.0
  • Multiple expansion: 1 PCIe x16, 8 PCIe x1
  • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
  • Dual channel DDR4 2133MHz SODIMM up to 32GB
  • 15-Year CPU Life Cycle Support Until Q4′ 29 (Based on Intel IOTG Roadmap)

Customisation Service

We can configure this device for you to your exact specification. So we can provide you with the best possible service, please let us know a little about your project if you need this service.



DFI, a leading provider offering a wide range of embedded products for industrial applications, its new products based on 6th Gen Intel® Core™ processor family (codename Skylake), and it includes the following: 12 industrial motherboards, 2 single board computers (SBC), 4 COM Express modules and 1 compact ULT-based embedded system. These latest Intel® Core™ processors are built on Intel’s new 14nm technology using 2nd generation 3-D tri-gate transistors and deliver blazing fast computing and graphics performance. These new 19 products come with LGA/BGA-package processors designed with the Intel® C236/100 Series chipsets to target the IoT (Internet of Things) smart computing solutions that require scalable processing power, enhanced display capabilities, and product stability. DFI, as an associate member of the Intel® Internet of Things Solutions Alliance, works closely with Intel on development of next-generation standards-based building blocks, platforms and solutions for the embedded market segments. To ensure our customers stay ahead of the competition, DFI has deployed a complete product line applying the 6th Gen Intel® Core™ processor. DFI’s 6th Gen Intel® Core™ processor-based boards support up to 3 independent video streams and increased display resolutions to provide a stunning Ultra HD 4K media experience. This new generation platform allows the embedded boards to drive breathtaking 3D video content and multiple displays simultaneously for a variety of graphics and compute-intensive solutions including medical imaging, gaming, digital signage, etc. The new embedded solutions are also able to support DDR4 memory with optional ECC capability which offers customers optimizing speed and power efficiency to process data faster and draw on the improved responsiveness. Taking the advantages of DDR4 memory, the motherboards can satisfy the ever-increasing workload demands of data centers and enterprise servers nowadays. A new version of Intel® vPro™ Technology features, such as Intel® Active Management Technology 11.0, enable enterprises to remotely manage and repair their workstations or servers in real time, thereby increasing efficiency. Furthermore, Intel® VT and Intel® TXT improve security and reliability by allowing critical applications like bank transaction to run safely in isolation and preventing unauthorized software from starting up. With this new platform, the DFI’s industrial motherboards are expected to satisfy an array of embedded vertical markets and smart solutions in IoT networks with high speed I/O, cost-efficient, excellent security and manageability features.




Ordering Info



Cooler, Intel Xeon E3-1515M v5, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C



Heat Spreader, Intel Core i7-6820EQ, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, -40 to 85°C



Cooler, Intel Core i3-6100E, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C



Cooler, Intel Celeron G3900E, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C



Cooler, Intel Core i5-6440EQ, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C



Cooler, Intel Core i7-6820EQ, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C



Cooler, Intel Core i7-6822EQ, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C



Cooler, Intel Core i5-6442EQ, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C


System Integration

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Global Operations

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Full Warranty

Industry leading warranties on all solutions as standard

Technical Support

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System   Processor 6th Generation Intel® Core™ Processors, BGA 1440Intel® Xeon® E3-1515M v5 Processor, Quad Core, 8M Cache, 2.8GHz (3.7GHz), 45WIntel® Core™ i7-6820EQ Processor, Quad Core, 8M Cache, 2.8GHz (3.5GHz), 45WIntel® Core™ i7-6822EQ Processor, Quad Core, 8M Cache, 2.0GHz (2.8GHz), 25WIntel® Core™ i5-6440EQ Processor, Quad Core, 6M Cache, 2.7GHz (3.4GHz), 45WIntel® Core™ i5-6442EQ Processor, Quad Core, 6M Cache, 1.9GHz (2.7GHz), 25WIntel® Core™ i3-6100E Processor, Dual Core, 3M Cache, 2.7GHz, 35WIntel® Core™ i3-6102E Processor, Dual Core, 3M Cache, 1.9GHz, 25WIntel® Celeron® Processor G3900E, Dual Core, 2M Cache, 2.4GHz, 35WIntel® Celeron® Processor G3902E, Dual Core, 2M Cache, 1.6GHz, 25W Chipset Intel® CM236 Chipset (Support ECC)Intel® QM170 Chipset Memory Two 260-pin SODIMM up to 32GB Dual Channel DDR4 2133MHz BIOS Insyde SPI 128Mbit   Graphics   Controller Intel® HD Graphics Feature OpenGL up to 4.4, DirectX 12, OpenCL 2.1HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9 Display 1 x VGA/DDI (DDI available upon request)1 x LVDS/eDP (eDP available upon request)2 x DDI (HDMI/DVI/DP++)VGA: resolution up to 1920×1200 @ 60HzLVDS: dual channel 24-bit, resolution up to 1920×1200 @ 60HzHDMI: resolution up to 4096×2160 @ 24Hz or 2560×1600 @ 60HzDVI: resolution up to 1920×1200 @ 60HzDP++/eDP: resolution up to 4096×2304 @ 60Hz Triple Displays VGA + LVDS + DDI or VGA + DDI1 + DDI2eDP + 2 DDI (available upon request)   Expansion   Interface 1 x PCIe x16 or 2 x PCIe x8 (Gen 3)8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 (Gen 3)1 x LPC1 x I2C1 x SMBus2 x UART (TX/RX)   Audio   Interface HD Audio   Ethernet   Controller 1 x Intel® I219LM with iAMT11.0 PCIe (10/100/1000Mbps)   I/O   USB 4 x USB 3.08 x USB 2.0 SATA 4 x SATA 3.0 (up to 6Gb/s) RAID 0/1/5/10 DIO 1 x 8-bit DIO   Watchdog Timer   Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds   Power   Type 12V, 5VSB, VCC_RTC (ATX mode)12V, VCC_RTC (AT mode) Consumption Typical: i7-6820EQ: 12V @ 2.39A (28.62Watt)Max.: i7-6820EQ:12V @ 5.84A (70.10Watt)   OS Support   OS Support Windows 8.1 64-bitWindows 7 (/WES7) 32/64-bitWindows 10 IoT Enterprise 64-bitDebian 8 (with VESA graphic driver)CentOS 7 (with VESA graphic driver)Linux   Environment   Temperature Operating: 0 to 60°C, -40 to 85°CStorage: -40 to 85°C Humidity Operating: 5 to 90% RHStorage: 5 to 90% RH MTBF 663,394hrs @ 25°C; 334,612 hrs @ 45°C; 193,307 hrs @ 60°C excluding accessoriesCalculation Model: Telcordia Issue 2, Method Case 3Environment: GB, GC – Ground Benign, Controlled   Mechanism   Dimensions COM Express® Basic 95mm (3.74″) x 125mm (4.9″) Compliance PICMG COM Express® R2.1, Type 6   Standards and Certifications   Certifications CE, FCC   Packing List   Packing List 1 SH960-CM236/QM170 board1 Cooler (Height: 36.58mm): (Standard) A71-111026-000G or 1 Heat spreader (Height: 11mm): A71-011073-000G