DFI COM332-B(R.A) with COM Express R2.1, Pin-out Type 6 + microATX form factor

Specification

Graphics   Display 1 x VGA1 x LVDS/eDP (eDP available upon request)3 x DP1 x eDP/LVDS (LVDS available upon request)   Expansion   Interface 1 x PCIe x166 x PCIe x12 x Full-size Mini PCIe1 x SDIO   Audio   Audio Codec Realtek ALC888S-VD2-GR   Rear I/O   Ethernet 1 x GbE (RJ-45) USB 4 x USB 3.04 x USB 2.0 Display 3 x DP Audio 1 x Line-in1 x Line-out1 x Mic-in   Internal I/O   Serial 2 x Serial Interface Connector (TX/RX) Display 1 x VGA (2.54mm)1 x LVDS LCD Panel Connector1 x LCD/Inverter Power1 x eDP LCD Panel Connector Audio 1 x Audio (Line-out/Mic-in)1 x S/PDIF SATA 4 x SATA 3.0 (up to 6Gb/s) DIO 1 x 8-bit DIO LPC 1 x LPC SMBus 1 x SMBus   Power   Type 12V, 5VSB, VCC_RTC (ATX mode)12V, VCC_RTC (AT mode) Connector 4-pin ATX 12V power24-pin ATX power RTC Battery CR2032 Coin Cell   Environment   Temperature Operating: 0 to 60°CStorage: -40 to 85°C Humidity Operating: 5 to 90% RHStorage: 5 to 90% RH MTBF 488,117 hrs @ 25°C; 253,684 hrs @ 45°C; 136,621 hrs @ 60°CCalculation Model: Telcordia Issue 2, Method Case 3Environment: GB, GC – Ground Benign, Controlled   Mechanism   Dimensions microATX Form Factor244mm (9.6″) x 244mm (9.6″) Compliance PICMG COM Express® R2.1, Type 6Basic, Compact Modules   Packing List   Packing List 1 COM332-B(R.A) board1 Serial ATA data cable (Length: 500mm): 332-553001-005G1 VGA cable: A81-012000-000G