DFI AL700 Qseven Module with Intel Atom E3900 Series + Supports triple displays


DFI AL700 Qseven Module with Intel Atom E3900 Series + Supports triple displays


  • Intel Atom® E3900 Series
  • Rich I/O: 1 x Intel GbE, 1 x USB 3.0, 8 x USB 2.0
  • Multiple expansions: 4 PCIe x1
  • 1 DDI*, 1 LVDS*/(eDP + DDI) Supports triple displays: eDP+2DDI
  • 4GB/8GB DDR3L Dual Channel Memory Down
  • 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)

Customisation Service

We can configure this device for you to your exact specification. So we can provide you with the best possible service, please let us know a little about your project if you need this service.



DFI launched new products to provide enhanced processing capability, low-power consumption, and brilliant graphic performance under Goldmont architecture with 14nm manufacturing node. Relying on DFI’s innovative abilities in design and manufacture, these products are small-sized, fanless, and support extended temperature range from -40°C up to +85°C, which makes it a perfect suite for many space-constrained and thermally limited embedded applications. These products are able to survive under a wide -40°C to +85°C operating temperature range. Satisfying the demands of industries in harsh environments with the need of thermal solution designs. Also, this outstanding fanless design makes awesome system integration. With the latest processor under Goldmont architecture, these boards offer 30% significant improvement for processing and intense graphic performance (Gen9), it also saves an average of 9 watts TDP energy. The new series powered by enhanced graphic engine from hardware decoding of HEVC and VP9 codecs supports 4K high resolution (DP: 4096×2304 @ 60Hz) and three independent displays for medical and multimedia solution. As for storage, these new products will support high speed SATA 3.0 drives, SSD and eMMC 5.0 options up to 128GB. Specially, advanced M.2 interface that integrating multiple functions including Wi-Fi/LTE/mSATA is the ideal choice for automation, storage and design of IoT appliances. Based on the new E3900 series processor, DFI has created a wide array of rugged and reliable industrial motherboards and modules, including Mini-ITX, SBC, Pico-ITX, COM Express, Qseven R2.1. Collocating with Windows 10 platform characterized by its security functions, DFI’s E3900 series products featured small-sized and rugged-design and are ready to meet IoT demands. With the integration, these products can comprehensively help our clients simplify development of IoT-connected devices and generate total IoT solution. 

Ordering Info


Fanless, Intel Atom x5-E3950, 1 LVDS, 1 LAN, 1 USB 3.0, 8 USB 2.0, 4GB DDR3L Memory Down , 0 to 60°C


Fanless, Intel Atom x5-E3930, 1 LVDS, 1 LAN, 1 USB 3.0, 8 USB 2.0, 4GB DDR3L Memory Down , -40 to 85°C


Fanless, Intel Atom x5-E3940, 1 LVDS, 1 LAN, 1 USB 3.0, 8 USB 2.0, 4GB DDR3L Memory Down , -40 to 85°C


System Integration

Please ask about how we can configure your solution

Global Operations

We ship and support products via offices globally

Full Warranty

Industry leading warranties on all solutions as standard

Technical Support

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System   Processor Intel Atom® Processor E3900 Series, BGA 1296Intel Atom® x7-E3950 Processor, Quad Core, 2M Cache, 1.6GHz (2.0GHz), 12WIntel Atom® x5-E3940 Processor, Quad Core, 2M Cache, 1.6GHz (1.8GHz), 9.5WIntel Atom® x5-E3930 Processor, Dual Core, 2M Cache, 1.3GHz (1.8GHz), 6.5WIntel® Pentium® Processor N4200, Quad Core, 2M Cache, 1.1GHz (2.5GHz), 6WIntel® Celeron® Processor N3350, Dual Core, 2M Cache, 1.1GHz (2.4GHz), 6W Memory 4GB/8GB DDR3L Memory DownDual Channel DDR3L 1600MHz BIOS AMI SPI 128Mbit (supports UEFI boot only)   Graphics   Controller Intel® HD Graphics Gen9LP Series Feature OpenGL 5.0, DirectX 12, OpenCL 2.1HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVCHW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC Display 1 x DDI (HDMI/DVI/DP++)1 x LVDS/(eDP+DDI) (DDI available upon request)LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920×1200 @ 60HzHDMI: resolution up to 3840×2160 @ 30 HzDP++: resolution up to 4096×2160@60HzeDP: resolution up to 3840×2160 @ 60Hz Dual Displays/ Triple Displays LVDS + DDI (Dual)eDP + DDI (Dual)eDP+2DDI (Triple) (available upon request)   Expansion   Interface 4 x PCIe x1 (Gen 2)1 x SDIO (with LED)1 x LPC1 x I2C1 x SMBus1 x SPI1 x UART (TX/RX)   Audio   Interface HD Audio   Ethernet   Controller 1 x Intel® I211AT (10/100/1000Mbps) (0~60°C)1 x Intel® I210IT (10/100/1000Mbps) (-40 to 85°C)   I/O   USB 1 x USB 3.0 + 8 x USB 2.03 x USB 3.0 + 4 x USB 2.0 (option) SATA 2 x SATA 3.0 (up to 6Gb/s) eMMC Supports up to 32GB eMMCeMMC 5.0, BGA-153 Ball 8~32G (MLC mode) GPIO 1 x 4-bit GPIO   Watchdog Timer   Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds Security   FTPM Enables or Disables the BIOS support for the security device   Power   Type 5V, 5VSB, VCC_RTC Consumption Typical: E3940: 12V @ 0.53A (6.36W)Max.: E3940: 12V @ 1.78A (21.36W)   OS Support   OS Support (UEFI Only) Windows 10 IoT Enterprise 64-bitLinux   Environment   Temperature Operating: 0 to 60°C, -40 to 85°CStorage: -40 to 85°C Humidity Operating: 5 to 90% RHStorage: 5 to 90% RH MTBF 1,020,531 hrs @ 25°C; 583,481 hrs @ 45°C; 364,855 hrs @ 60°CCalculation model: Telcordia Issue 2Environment: GB, GC – Ground Benign, Controlled   Mechanism   Dimensions Qseven form factor 70mm (2.76″) x 70mm (2.76″) Compliance Qseven specification revision 2.1   Standards and Certifications   Certifications CE, FCC Class B, RoHS   Packing List   Packing List 1 AL700 board1 Heat sink: TBD